Printed circuit board
A ground conductor film is formed at an insulating substrate. A floating conductor film capacitively couples to the ground conductor film. A radiating element is connected to the floating conductor film. A shielding film shields an electromagnetic wave radiated from the radiating element. By applying such a configuration to a printed circuit board, noise reduction can be achieved.
1. A printed circuit board comprising:
a ground conductor film formed at an insulating substrate;
a floating conductor film capacitively coupled to the ground conductor film;
a radiating element connected to the floating conductor film;
a shielding film shielding an electromagnetic wave radiated from the radiating element; and
a plurality of pads disposed in an integrated circuit mounting area of the insulating substrate within which an integrated circuit is to be mounted, wherein
the shielding film is formed of a conductive material and connected to the ground conductor film,
a noise current flows from the ground conductor film to the floating conductor film,
the floating conductor film is disposed at a same conductor layer as the ground conductor film, and
the shielding film and the floating conductor film are disposed not to overlap with the integrated circuit mounting area in a plan view.
2. The printed circuit board according to claim 1 , wherein the radiating element includes a conductor pattern disposed at a conductor layer different from the floating conductor film.
3. The printed circuit board according to claim 2 , wherein the shielding film is disposed such that the shielding film is spaced from the conductor pattern in a direction of a thickness.
4. The printed circuit board according to claim 1 , wherein the shielding film is formed of a magnetic material.