IP Library › Granted Patent US 10,207,377
Granted Patent B2
US 10,207,377 · App. 15/529,033 · Granted Feb 19, 2019

Device for machining a planar workpiece

Inventors: Matthias Kienholz (Biebertal, DE); Lars Martin (Münzenberg, DE); Kersten Wurm (Dietzenbach, DE); Alexander Glowacki (Karben, DE)
Assignee: Rittal GmbH & Co. Kg
B23Q3/002B23Q3/069B23Q11/0046B23Q2240/002
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Quick Facts
Patent No.
US 10,207,377
App. No.
15/529,033
Granted
Feb 19, 2019
Kind
B2
Abstract

The invention relates to a device for machining a planar workpiece, having a machine stand which has a support surface (application surface) for a planar workpiece, and further having a machining head which can be moved relative to the support surface, which machining head has a tool for machining the workpiece and also has a holding unit (“hold-down unit”) with a pressure plate whereby the workpiece is pressed against the supporting surface; characterized in that the pressure plate has a structure which is comprised of a plurality of pieces, preferably two pieces, wherein at least one of the pressure plate parts is movable back and forth relative to at least one other pressure plate part, namely it is movable between the application position, in which the pressure plate part presses the workpiece against the application surface when the workpiece is applied to said application surface, and a released position, in which the pressure plate piece is at a minimum distance away from the workpiece when the workpiece is applied to said application surface.

Claims (9)

1. A device for machining a planar workpiece, comprising:

a hold-down unit having a divided application surface for engaging a planar workpiece, the application surface being defined by a plurality of pressure plates movable relative to each other;

a displacing unit coupled to at least one of the pressure plates for moving at least one of the pressure plates against the workpiece while the other pressure plate is displaced from the workpiece; and

adjacent edges of the pressure plates defining an opening through which a machine tool can extend to perform work on the workpiece when the workpiece is engaged by the application surface.

2. The device according to claim 1 which further comprises at least one bearing on each of the pressure plates so that the machine tool can be easily guided over the workpiece.

3. The device according to claim 2 wherein the bearing comprises at least one spherical roller having air flowing around it so that foreign bodies on the workpiece are blown away from the roller.

4. The device according to claim 1 which further comprises:

a chip removal system located adjacent the pressure plates opposite the application surface for removing chips generated by machining of the workpiece by a machine tool.

5. The device according to claim 4 wherein the chip removal system has a suction chamber through which the machine tool extends.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2017
From: KIESLING MASCHINENTECHNIK GMBH
To: RITTAL GMBH & CO. KG
Reel/Frame 043873/0840 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2017
From: KIENHOLZ, MATTHIAS; MARTIN, LARS; WURM, KERSTEN; GLOWACKI, ALEXANDER
To: KIESLING MASCHINENTECHNIK GMBH
Reel/Frame 042564/0279 →
Priority Claims (1)
DE 10 2014 117 130 · Nov 24, 2014 · national
Continuity (1)
Related Publication 20170259386A1 · Sep 14, 2017