Printed circuit board and electric device
A printed circuit board includes a power feeding layer to which a power supply voltage is applied, a plurality of power feeding terminals that is disposed in an area, in which an electronic component is mounted, and supplies current based on the power supply voltage to the electronic component, and a plurality of vias that electrically interconnects the plurality of power feeding terminals and the power feeding layer, and is formed such that a via coupled to a power feeding terminal disposed closer to an end of the area has a smaller via-diameter.
1. A printed circuit board comprising:
a power feeding layer to which a power supply voltage is applied;
a plurality of power feeding terminals that is disposed in an area, in which an electronic component is mounted, and supplies current based on the power supply voltage supplied from a power source to the electronic component through the power feeding layer and the plurality of power feeding terminals; and
a plurality of vias each of which directly and electrically interconnects each of the plurality of power feeding terminals and the power feeding layer, and is formed such that a via coupled to a power feeding terminal disposed closer to the power source has a smaller via-diameter to reduce a difference in path resistances between the plurality of power feeding terminals.
2. The printed circuit board according to claim 1 , wherein, among the plurality of vias, a first via, which is coupled to a second power feeding terminal disposed at a position to which a distance from the end of the area is shorter than a distance to a first power feeding terminal, is located in a current path, in which the current flows, upstream of a second via coupled to the first power feeding terminal, and the first via has a first via-diameter smaller than a second via-diameter of the second via.
3. The printed circuit board according to claim 1 , wherein, among the plurality of vias, a third via, which is coupled to a fourth power feeding terminal disposed at a position to which a distance from a center of the area is shorter than a distance to a third power feeding terminal, is coupled to a larger number of power feeding layers than a fourth via, which is coupled to the third power feeding terminal.
4. The printed circuit board according to claim 1 , wherein a plurality of power feeding layers is provided including the power feeding layer, and among the plurality of vias, a fifth via, which is coupled to a sixth power feeding terminal disposed at a position to which a distance from a center of the area is shorter than a distance to a fifth power feeding terminal, is coupled to a second power feeding layer among the plurality of power feeding layers, the fifth power feeding terminals being located closer to a surface on which the electronic component is mounted, than a first power feeding layer coupled to a sixth via coupled to the fifth power feeding terminal.
5. The printed circuit board according to claim 1 , wherein, among the plurality of vias, a conductive resin material is embedded in a seventh via, which is coupled to an eighth power feeding terminal disposed at a position to which a distance from a center of the area is shorter than a distance to a seventh power feeding terminal, and a non-conductive resin material is embedded in the eighth via, which is coupled to the seventh power feeding terminal.
6. The printed circuit board according to claim 5 , wherein both the conductive resin material and the non-conductive resin material are embedded in the seventh via.
7. The printed circuit board according to claim 1 , wherein the power feeding layer is formed with an opening, which is patterned to be partially coupled to a ninth via among the plurality of vias.
8. The printed circuit board according to claim 7 , wherein the opening has an elliptical shape, a long axis of which extends in a power feeding direction.
9. An electronic device comprising:
an electronic component; and
a printed circuit board including:
a power feeding layer to which a power supply voltage is applied;
a plurality of power feeding terminals that is disposed in an area, in which an electronic component is mounted, and supplies current based on the power supply voltage supplied from a power source to the electronic component through the power feeding layer and the plurality of power feeding terminals; and
a plurality of vias each of which directly and electrically interconnects each of the plurality of power feeding terminals and the power feeding layer, and is formed such that a via coupled to a power feeding terminal disposed closer to the power source has a smaller via-diameter to reduce a difference in path resistances between the plurality of power feeding terminals.