Apparatus for treating substrate

1. A substrate-treating apparatus comprising:

a support unit on which a substrate is loaded;

a blade unit at a side of the support unit and configured to remove a layer on the substrate loaded on the support unit;

an optical measurement unit configured to provide light to the substrate to obtain image data, the optical measurement unit configured to,

check whether the substrate is abnormal or not, based on the image data, and

check a wear level of the blade unit; and

a controller configured to control the support unit and the optical measurement unit, the controller configured to process the image data transmitted from the optical measurement unit,

wherein the controller includes,

an interlock configured to perform an interlock operation interrupting a process performed on the substrate if an abnormal signal is detected from the image data, and

wherein the controller is configured to perform an interlock operation interrupting operation of the blade unit, based on the wear level of the blade unit.

2. The substrate-treating apparatus of claim 1 , wherein the optical measurement unit comprises:

an optical member configured to provide the light to the substrate; and

a reflection member spaced apart from the optical member, the reflection member configured to reflect the light from the optical member to adjust a measurement range of the light.

3. The substrate-treating apparatus of claim 2 , wherein the controller further comprises:

an image control part configured to monitor the image data received from the optical measurement unit,

wherein the image control is configured to transmit the abnormal signal to the interlock when the abnormal signal is detected.

4. The substrate-treating apparatus of claim 3 , wherein the optical measurement unit further includes,

a shaft configured to support the optical member and configured to control a first direction corresponding to a height of the optical member, and

a driving part on the shaft, the driving part configured to move the optical member in a second direction and a third direction, the second direction and third direction perpendicular to the first direction.

5. The substrate-treating apparatus of claim 4 , wherein the optical member includes a plurality of optical members.

6. The substrate-treating apparatus of claim 5 , wherein the optical measurement unit comprises:

a first optical member and a second optical member,

wherein the first optical member is configured to check whether a central area of the substrate is abnormal or not, and

wherein the second optical member is configured to check whether an edge area of the substrate is abnormal or not.

7. The substrate-treating apparatus of claim 6 , wherein the reflection member of the optical measurement unit comprises:

a first mirror opposite to the first optical member; and

a second mirror opposite to the second optical member,

wherein the first mirror is over the central area, and

wherein the second mirror is over the edge area.

8. The substrate-treating apparatus of claim 7 , wherein the controller is configured to rotate the support unit to rotate the substrate when the optical measurement unit checks whether the substrate is abnormal or not.

9. The substrate-treating apparatus of claim 6 ,

wherein the controller is configured to control the support unit, the optical measurement unit and the blade unit.

10. The substrate-treating apparatus of claim 9 , wherein the optical measurement unit further comprises: a third optical member over the blade unit, and

wherein the third optical member configured to check the wear level of blade unit.

11. The substrate-treating apparatus of claim 1 , wherein the abnormal signal includes at least one of a signal corresponding to a chipping, a signal corresponding to a crack, a signal corresponding to a broken phenomenon, or a signal corresponding to a foreign substance.

12. The substrate-treating apparatus of claim 1 , wherein the controller is configured to operate an alarm when the abnormal signal is detected.

13. A substrate-treating apparatus comprising:

a support unit on which a substrate is loaded, the substrate including a first carrier wafer bonded to a second device wafer;

a blade unit configured to perform a process of treating the substrate, the blade unit configured to debond the second device wafer from the first carrier wafer;

an optical measurement unit configured to provide light to check a wear level of the blade unit, the optical measurement unit configured to obtain image data corresponding to the wear level; and

a controller configured to control the support unit, the blade unit, and the optical measurement unit,

wherein the controller is configured to

process the image data received from the optical measurement unit, and

perform an interlock operation interrupting the process when the wear level of the blade unit indicates the blade unit is worn.

14. The substrate-treating apparatus of claim 13 , wherein the controller is configured to perform an interlock operation interrupting the process when at least one of an abnormal signal of the substrate or an abnormal position signal of the blade unit is detected.

15. The substrate-treating apparatus of claim 14 , wherein the process includes removing a layer on the substrate, and

wherein the optical measurement unit configured to detect the position of the blade unit when the blade unit approaches the layer to remove the layer.

16. The substrate-treating apparatus of claim 15 , wherein the optical measurement unit comprises: a first optical member and a second optical member,

wherein the first optical member configured to check whether a central area of the substrate is abnormal or not, and

wherein the second optical member configured to check whether an edge area of the substrate is abnormal or not.

17. The substrate-treating apparatus of claim 14 , wherein the abnormal signal of the substrate includes at least one of a signal corresponding to a chipping, a signal corresponding to a crack, a signal corresponding to a broken phenomenon, or a signal corresponding to a foreign substance.

18. The substrate-treating apparatus of claim 16 , wherein the optical measurement unit further comprises: a third optical member and a fourth optical member,

wherein the third optical member is over the blade unit to check the wear level of the blade unit, and

wherein the fourth optical member is spaced apart from the blade unit and configured to detect the position of the blade unit.