IP Library Granted Patent US 10,221,090
Granted Patent B2
US 10,221,090 · App. 13/501,056 · Granted Mar 5, 2019

Transparent substrate

Inventors: Takeshi Murashige (Ibaraki, JP); Daisuke Hattori (Ibaraki, JP); Yoshimasa Sakata (Ibaraki, JP); Takashi Yamaoka (Ibaraki, JP); Tatsuki Nagatsuka (Ibaraki, JP)
Assignee: NITTO DENKO CORPORATION
C03C17/32B32B17/064C03C17/3405B32B2307/412B32B2307/536B32B2307/542B32B2307/544B32B2307/546C03C2218/365G02F2001/133302Y10T156/10Y10T428/2495Y10T428/266
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Quick Facts
Patent No.
US 10,221,090
App. No.
13/501,056
Granted
Mar 5, 2019
Kind
B2
Abstract

The present invention provides a transparent substrate that significantly prevents the progress of a crack in a thin-plate glass and the rupture of the glass, and is excellent in bending property and flexibility. A transparent substrate according to an embodiment of the present invention includes: a thin-plate glass having a thickness of 10 μm to 100 μm; and a resin layer on at least one side of the thin-plate glass, wherein a shrinkage stress of the resin layer on the thin-plate glass is 5 MPa or more.

Claims (24)

1. A transparent substrate, comprising:

a thin-plate glass having a thickness of 10 μm to 100 μm; and

a resin layer on at least one side of the thin-plate glass,

wherein the resin layer comprises a thermoplastic resin,

wherein a shrinkage stress of the resin layer on the thin-plate glass is 5 MPa to 25 MPa, and

wherein the resin layer has a thickness of 5 μm to 80 μm.

2. The transparent substrate according to claim 1 , wherein a ratio (d2/d1) between the thickness (d1) of the thin-plate glass and a total thickness (d2) of the resin layer is 0.3 to 4.

3. The transparent substrate according to claim 1 or 2 , wherein the resin layer has a modulus of elasticity at 25° C. of 1.0 GPa or more.

4. The transparent substrate according to claim 1 , wherein the resin layer has a fracture toughness value at 25° C. of 1.5 MPa·m1/2 or more.

5. The transparent substrate according to claim 1 , wherein the resin has a glass transition temperature of 150° C. to 350° C.

6. The transparent substrate according to claim 1 , wherein the resin layer is obtained by

applying a solution comprising the thermoplastic resin to a surface on at least one side of the thin-plate glass to form an applied layer and

drying the applied layer.

7. The transparent substrate according to claim 1 , wherein the thin-plate glass and the resin layer are placed through an adhesion layer.

8. The transparent substrate according to claim 7 , wherein the resin layer is obtained by

attaching a thermoplastic resin film to a surface on at least one side of the thin-plate glass through the adhesion layer to form a laminate and

subjecting the laminate to a heating treatment.

9. The transparent substrate according to claim 1 , further comprising a hard coat layer having a pencil hardness of H or more on a side of the resin layer opposite to the thin-plate glass.

10. The transparent substrate according to claim 1 , wherein the transparent substrate is used as a substrate for a display device.

11. The transparent substrate according to claim 1 , wherein the transparent substrate is used as a substrate for a solar cell.

12. The transparent substrate according to claim 1 , wherein the transparent substrate is used as a substrate for a lighting device.

13. A display device, comprising the transparent substrate according to claim 1 .

14. A solar cell, comprising the transparent substrate according to claim 1 .

15. A lighting device, comprising the transparent substrate according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2012
From: MURASHIGE, TAKESHI; HATTORI, DAISUKE; SAKATA, YOSHIMASA; YAMAOKA, TAKASHI; NAGATSUKA, TATSUKI
To: NITTO DENKO CORPORATION
Reel/Frame 028018/0730 →
Priority Claims (1)
JP 2009-244142 · Oct 23, 2009 · national
Continuity (1)
Related Publication 20120196103A1 · Aug 2, 2012