Lighting module comprising at least one component and a connector which are disposed on a heat dissipater, and lighting device for automotive vehicle comprising such a module
A module comprising an electronic component and an electrical connector that are interconnected by a printed circuit board that is fastened to a heat sink, the connector includes a housing, connection contacts and a bundle of wires, which are secured to the housing and respectively interconnected electrically. The housing is arranged on one side of the board such that the contacts pass through the board so as to emerge onto the other side and to be connected electrically there. The board is fastened to the heat sink by the side thereof bearing the contacts. The surface of the heat sink receives the board having a boss at least level with the contacts, so as to avoid electrical contact between the contacts and the heat sink.
1. A lighting module comprising:
at least one electronic component including at least one semiconductor emitter chip and an electrical connector, the component and the connector being interconnected by an electrical interconnection device, the interconnection device and the at least one electronic component being fastened to a surface of a heat sink, wherein
the connector comprises electrical connection contacts,
the connector is arranged on one side of the interconnection device such that the contacts pass through the interconnection device so as to emerge onto another side of the interconnection device, where the contacts are connected electrically to the interconnection device,
the connector is connected between the interconnection device and circuitry that projects out of the lighting module to establish an electrical connection with an apparatus external to the lighting module,
the interconnection device is fastened to the heat sink via the another side onto which the contacts emerge, and
the surface of the heat sink that receives the interconnection device has a cavity at least level with the contacts, so as to avoid electrical contact between the contacts and the heat sink.
2. The module according to claim 1 , wherein the electronic component is arranged on the heat sink and is connected electrically to the interconnection device.
3. The module according to claim 1 , wherein the electronic component is arranged on the interconnection device and connected electrically thereto.
4. The module according to claim 1 , wherein the interconnection device makes thermal contact with the heat sink.
5. The module according to claim 1 , wherein the cavity has a depth making it possible to leave a space between the contacts and the heat sink large enough to prevent electrical arcing between the contacts and the heat sink.
6. The module according to claim 1 , wherein the heat sink is substantially L-shaped.
7. The module according to claim 6 , wherein the interconnection device is fastened to the heat sink via one of arms of the L formed by the heat sink.
8. The module according to claim 1 , wherein the cavity of the heat sink is formed by embossing.
9. The module according to claim 1 , wherein the cavity of the heat sink comprises holes to drain any accumulation of water.
10. The module according to claim 1 , wherein an electrical connection between the contacts and the interconnection device is obtained by wave soldering or a pushed-in-type contact.
11. A lighting and/or signaling device for a motor vehicle, wherein the lighting and/or signaling device comprises a carrier and the module according to claim 1 , the module being fastened to the carrier of said lighting and/or signaling device.
12. The lighting and/or signaling device according to claim 11 , wherein the module is fastened to the carrier via the heat sink.
13. The lighting and/or signaling device according to claim 11 , wherein, the heat sink is fastened to the carrier via one of arms of an L formed by the heat sink.
14. The lighting and/or signaling device according to claim 11 , wherein the carrier is a reflector of said lighting and/or signaling device.
15. The module according to claim 3 , wherein the interconnection device makes thermal contact with the heat sink.
16. The module according to claim 4 , wherein the cavity has a depth making it possible to leave a space between the contacts and the heat sink large enough to prevent electrical arcing between the contacts and the heat sink.
17. The module according to claim 7 , wherein the cavity of the heat sink is formed by embossing.
18. The module according to claim 1 , wherein the cavity is an empty air space.