Light emitting device and method for manufacturing light emitting device
A light emitting device ( 10 ) includes light emitting elements ( 12 ), conductor wirings ( 14 ), and alignment marks ( 18 ) formed on a substrate ( 11 ). The alignment marks ( 18 ) and the conductor wirings ( 14 ) are formed by printing.
1. A light emitting device comprising:
an insulating substrate having a single layer structure;
a light emitting element mounted and disposed on the insulating substrate by an adhesive resin;
a conductor wiring disposed on the insulating substrate, the conductor wiring surrounding a light emitting element mounting area, the conductor wiring electrically connected with the light emitting element;
at least one alignment mark;
a pair of lands for supplying power to the light emitting element and opposed to each other across the mounting area of the light emitting element;
at least one polarity mark formed in the vicinity of at least one of the lands and comprising a metal material; and
an annular light reflecting resin frame, the light emitting element is surrounded by the annular light reflecting resin frame; wherein
the conductor wiring is covered by the light reflecting resin frame,
the at least one alignment mark is located inside the annular light reflecting resin frame in top view, and
the alignment mark is not covered by the light reflecting resin frame.
2. The light emitting device according to claim 1 ,
wherein visual recognitions of polarities of electrodes comprise a plus-shaped polarity mark formed near an anode electrode and a minus-shaped polarity mark formed near a cathode electrode.
3. The light emitting device according to claim 2 ,
wherein the polarity marks for the anode and cathode are substantially disposed on opposite sides of the outside of the annular light reflecting resin frame.
4. The light emitting device according to claim 1 ,
wherein the at least one alignment mark and the conductor wiring are formed by printing,
wherein the at least one alignment mark is disposed in an opposed matter across the light emitting element mounting area, and
wherein the at least one alignment mark is partially or entirely exposed without being covered by the light reflecting resin frame.
5. The light emitting device according to claim 1 , further comprising a protection element disposed on the conductor wiring.