Printed circuit board structure
The invention relates to a printed circuit board structure with at least one dielectric insulating layer and at least one conductive layer, in which within the at least one insulating layer, a layer made of a dielectric thermally conductive material is provided that is located at least in the vicinity of, or in contact with, an inner conductor arrangement. Another thermally conductive layer, preferably an electrically conductive metal layer, can be provided in the immediate vicinity of, or in contact with, the layer made of a dielectric thermally conductive material. It is also possible for an at least thermally conductive, preferably electrically conductive feedthrough to pass from a conductor section lying on the outside of the printed circuit board into the inside of the printed circuit board, at least into the vicinity of the layer made of a dielectric thermally conductive material.
1. A printed circuit board structure comprising:
at least a first and a second dielectric insulating layers, and at least a first conductive layer, wherein the at least first conductive layer is arranged between the at least first and second dielectric insulating layers,
at least a second and a third conductive layers, wherein the second conductive layer is disposed on the outer surface of the first dielectric insulating layer such that the first dielectric insulating layer is disposed between the first and second conductive layers, and wherein the third conductive layer is disposed on the outer surface of the second dielectric insulating layer such that the second dielectric insulating layer is disposed between the first and third conductive layers;
an inner conductor track structure formed in the at least first conductive layer;
a layer of dielectric thermally conductive material embedded within one of the first and second dielectric insulating layers such that all but at least a first surface of the layer of dielectric thermally conductive material is surrounded by one of the first and second insulating layers, and wherein at least the first surface of the layer of dielectric thermally conductive material is disposed in the thermal conductive vicinity of, or in thermal conductive contact with the inner conductor track structure.
2. The printed circuit board structure according to claim 1 , further comprising at least one thermally conductive feedthrough that passes from a conductor section lying on the outside of a printed circuit board into the inside of the printed circuit board, at least into the thermal conductive vicinity of the layer of a dielectric thermally conductive material.
3. The printed circuit board structure according to claim 2 , wherein the thermally conductive feedthrough is electrically conductive, passes to the inner conductor track, and makes electrical contact with the inner conductor track.
4. The printed circuit board structure according to claim 1 , further comprising a feedthrough that passes from a first conductor section to a second conductor section lying at a distance from the first, the feedthrough also running at least in the thermal conductive vicinity of the layer of a dielectric thermally conductive material.
5. The printed circuit board structure according to claim 4 , wherein the feedthrough is connected with an inner conductor track structure.
6. The printed circuit board structure according to claim 4 , wherein the feedthrough passes from an outer conductive layer on one side of a printed circuit board to an outer conductive layer on the opposite side of the printed circuit board.
7. The printed circuit board structure according to claim 1 , wherein the layer of a dielectric thermally conductive material fills spaces within the conductor track structure.
8. The printed circuit board structure according to claim 1 , wherein the first surface of the layer of dielectric thermally conductive material is disposed in direct thermal conductive contact with the inner conductor track structure.
9. A printed circuit board structure comprising:
at least a first and a second dielectric insulating layers, and at least a first conductive layer, wherein the at least first conductive layer is arranged between the at least first and second dielectric insulating layers,
at least a second and a third conductive layers, wherein the second conductive layer is disposed on the outer surface of the first dielectric insulating layer such that the first dielectric insulating layer is disposed between the first and second conductive layers, and wherein the third conductive layer is disposed on the outer surface of the second dielectric insulating layer such that the second dielectric insulating layer is disposed between the first and third conductive layers;
an inner conductor track structure formed in the at least first conductive layer;
a layer of dielectric thermally conductive material embedded within one of the first and second dielectric insulating layers such that all but at least a first surface of the layer of dielectric thermally conductive material is surrounded by one of the first and second insulating layers, and wherein at least the first surface of the layer of dielectric thermally conductive material is disposed in the thermal conductive vicinity of, or in thermal conductive contact with the inner conductor track structure; and
a second thermally conductive layer is provided and embedded and entirely surrounded by the layer of dielectric thermally conductive material.
10. The printed circuit board structure according to claim 9 , wherein the second thermally conductive layer is an electrically conductive metal.