Display apparatus and manufacturing method thereof
The present aspects provide a display apparatus including a chip-on-film (COF), which may include: a plastic substrate configured to have at least one through-hole formed in one area thereof and a conductor inserted into the through-hole; a display part configured to be disposed in another area on an upper surface of the plastic substrate; a first pad part configured to have a plurality of pads, at least one of which is disposed in the one area on the upper surface of the plastic substrate to overlap the through-hole, and configured to be connected to one end of the conductor; and a second pad part configured to be disposed on a back surface of the plastic substrate, and configured to have a plurality of pads, at least one of which is in contact with the other end of the conductor, and further provide a method for manufacturing the same.
1. A display apparatus including a chip-on-film (COF), the apparatus comprising:
a plastic substrate having at least one through-hole in one area thereof and a conductor inserted into the through-hole;
a display part including a plurality of pixels and disposed in another area on a first surface of the plastic substrate;
a first pad part having a plurality of pads, at least one of the plurality of pads disposed on the first surface of the plastic substrate to overlap the through-hole, and electrically connected to one end of the conductor; and
a second pad part disposed on a second surface opposite to the first surface of the plastic substrate, and having a plurality of pads, at least one of the plurality pads of the second pad part is in contact with the other end of the conductor.
2. The display apparatus of claim 1 , wherein the plastic substrate comprises a first plastic substrate and a second plastic substrate.
3. The display apparatus of claim 2 , wherein the first plastic substrate has a hardness greater that the second plastic substrate.
4. The display apparatus of claim 3 , wherein the first plastic substrate includes a resin and the second plastic substrate includes a polyimide resin.
5. The display apparatus of claim 1 , wherein the plurality of pads of the first pad part has a width greater than a diameter of the through-hole.
6. The display apparatus of claim 1 , wherein the second pad part is a part of the chip-on-film (COF).
7. The display apparatus of claim 1 , further comprising an edge part surrounding the display part and accommodating a data wire for applying a data signal to a data line, a gate-in-panel (GIP) circuit for applying a gate signal to a gate line, a gate control signal wire for applying a gate control signal to the GIP circuit, and a common power supply line for applying a common power to the plurality of pixels.
8. A method for manufacturing a display apparatus, the method comprising:
forming a through-hole in at least one pad of a first pad part including a plurality of pads, which is formed in one area of a plastic substrate;
inserting a conductor into the through-hole such that one end of the conductor is connected to the pad and the other end of the conductor is exposed on a rear surface of the plastic substrate; and
connecting at least one pad of a chip-on-film (COF) having a second pad part including a plurality of pads to the other end of the conductor.
9. The method of claim 8 , wherein the plastic substrate comprises a first plastic substrate and a second plastic substrate.
10. The method of claim 9 , wherein the through-hole is formed to pass through both the first plastic substrate and the second plastic substrate in the forming of the through-hole.
11. The method of claim 8 , wherein the plurality of pads of the first pad part has a width is greater than a diameter of the through-hole.
12. The method of claim 8 , wherein the forming a through-hole in at least one pad of a first pad part is performed by a micro-drilling process.
13. The display apparatus of claim 9 , wherein the first plastic substrate has a hardness greater that the second plastic substrate.
14. The display apparatus of claim 13 , wherein the first plastic substrate includes a resin and the second plastic substrate includes a polyimide resin.