Light emitting device and fluidic manufacture thereof
Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
1. A method of manufacturing a light emitting device comprising:
forming a recess on a substrate;
providing an interlayer dielectric layer over the substrate;
creating a first hole in the interlayer dielectric layer opening over the recess of the substrate;
creating a second hole in the interlayer dielectric layer;
in a first fluid transport stage, fluidically transporting a first micro light emitting device to the first hole; and
in a second fluid transport stage, fluidically transporting a second micro light emitting device to the second hole.
2. The method of manufacturing the light emitting device of claim 1 , wherein a flow speed of the first fluid transport stage is faster than a flow speed of the second fluid transport stage.
3. The method of manufacturing a light emitting device of claim 1 , wherein a flow speed of the first fluid transport stage is a sustained speed of 5 to 200 μm/s during a trapping period of the first fluid transport stage.
4. The method of manufacturing a light emitting device of claim 1 , wherein a flow speed of the second fluid transport stage is a sustained speed of 5 to 100 μm/s during a trapping period of the second fluid transport stage.
5. The method of manufacturing a light emitting device in the claim 1 , wherein the depth of the recess formed in the substrate is substantially equal to a thickness of the first hole in the interlayer dielectric layer.
6. The method of manufacturing a light emitting device of claim 1 , further comprising:
creating a third hole in the interlayer dielectric layer; and
in a third fluid transport stage, fluidically transporting a third micro light emitting device to the third hole.
7. The method of manufacturing a light emitting device of claim 1 , further comprising:
forming a plurality of through holes in the substrate, each of the through holes corresponding to one of the first and second holes of the interlayer dielectric layer; and
in the first fluid transport stage or the second fluid transport stage, drawing a portion of a transport fluid into the through holes.