IP Library › Granted Patent US 10,230,073
Granted Patent B2
US 10,230,073 · App. 15/321,154 · Granted Mar 12, 2019

Organic light-emitting display panel and display device

Inventors: Wulin Shen (Beijing, CN); Jun Cheng (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L51/529H01L51/5237H01L51/5246H01L51/5259H01L51/5253
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Quick Facts
Patent No.
US 10,230,073
App. No.
15/321,154
Granted
Mar 12, 2019
Kind
B2
Abstract

The present invention provides an organic light-emitting display panel, comprising: a substrate; a light-emitting unit provided on the substrate; and a package structure covering the light-emitting unit. The organic light-emitting display panel further comprises a thermally conductive structure, and the thermally conductive structure is at a side of the light-emitting unit far away from the substrate. Correspondingly, the present invention further provides a display device. The thermally conductive structure provided by the present invention can rapidly dissipate the heat generated by the light-emitting unit, so that the organic light-emitting display panel has an improved performance and the display device has an extended service life.

Claims (24)

1. An organic light-emitting display panel, comprising:

a substrate;

a light-emitting unit provided on the substrate; and

a package structure covering the light-emitting unit;

wherein the organic light-emitting display panel further comprises a thermally conductive structure, and the thermally conductive structure is at a side of the light-emitting unit distal to the substrate; and

wherein the package structure comprises a package adhesive layer, and the thermally conductive structure comprises a thermally conductive particle provided in the package adhesive layer.

2. The organic light-emitting display panel according to claim 1 , wherein the thermally conductive particle has a diameter ranging from 1 μm to 3 μm.

3. The organic light-emitting display panel according to claim 1 , wherein the thermally conductive particle has a thermal conductivity ranging from 100 W/mK to 8,000 W/mK.

4. The organic light-emitting display panel according to claim 1 , wherein a material of the thermally conductive particle comprises any one or more of silver, copper, gold, aluminum, diamond, graphite, graphene, and carbon nanotube.

5. The organic light-emitting display panel according to claim 1 , wherein the thermally conductive structure comprises a thermally conductive layer provided between the light-emitting unit and the package structure.

6. The organic light-emitting display panel according to claim 5 , wherein the thermally conductive layer has a thickness ranging from 1 μm to 100 μm.

7. The organic light-emitting display panel according to claim 5 , wherein the thermally conductive layer has a thermal conductivity ranging from 100 W/mK to 8,000 W/mK.

8. The organic light-emitting display panel according to claim 5 , wherein a material of the thermally conductive layer comprises any one or more of silver, copper, gold, aluminum, diamond, graphite, graphene, and carbon nanotube.

9. The organic light-emitting display panel according to claim 1 , wherein the package structure further comprises a cover plate provided at a side of the package adhesive layer distal to the substrate, the organic light-emitting display panel further comprises a heat dissipation structure provided at a side of the cover plate distal to the substrate, and an outer surface of the heat dissipation structure has a larger area than that of a surface of the cover plate on which the heat dissipation structure is provided.

10. The organic light-emitting display panel according to claim 5 , further comprising a heat dissipation structure provided at a side of the package structure distal to the substrate, wherein an outer surface of the heat dissipation structure has a larger area than that of a surface of the package structure on which the heat dissipation structure is provided.

11. The organic light-emitting display panel according to claim 9 , wherein the heat dissipation structure comprises a heat sink and a plurality of fins which are provided on the heat sink and have an interval therebetween, and the heat sink is provided on the package structure.

12. The organic light-emitting display panel according to claim 11 , wherein each of the plurality of fins has a diameter ranging from 1 mm to 5 mm and a height ranging from 1 mm to 15 mm, and two adjacent ones of the plurality of fins have an interval ranging from 2 mm to 5 mm therebetween.

13. The organic light-emitting display panel according to claim 11 , wherein the plurality of fins and the heat sink are integrally formed.

14. The organic light-emitting display panel according to claim 1 , wherein a water absorption particle is provided in the package adhesive layer.

15. The organic light-emitting display panel according to claim 14 , wherein a material of the water absorption particle comprises calcium oxide.

16. The organic light-emitting display panel according to claim 14 , wherein the package adhesive layer comprises an inorganic film and an organic film which are provided sequentially on the light-emitting unit, a material of the inorganic film comprises any one or more of silicon nitride, silicon oxide, and silicon oxynitride, a material of the organic film comprises resin, and the thermally conductive particle and the water absorption particle are provided in the organic film.

17. A display device, comprising the organic light-emitting display panel according to claim 1 .

18. The organic light-emitting display panel according to claim 1 , wherein the thermally conductive structure comprises a thermally conductive layer provided between the light-emitting unit and the package structure.

19. The organic light-emitting display panel according to claim 10 , wherein the heat dissipation structure comprises a heat sink and a plurality of fins which are provided on the heat sink and have an interval therebetween, and the heat sink is provided on the package structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2016
From: SHEN, WULIN; CHENG, JUN
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 040746/0038 →
Priority Claims (1)
CN 2015 1 0142685 · Mar 27, 2015 · national
Continuity (1)
Related Publication 20170194596A1 · Jul 6, 2017