IP Library › Granted Patent US 10,232,620
Granted Patent B2
US 10,232,620 · App. 15/747,639 · Granted Mar 19, 2019

Printhead with s-shaped die

Inventors: Michael W. Cumbie (Albany, OR); Silam J. Choy (Corvallis, OR); Chien-Hua Chen (Corvallis, OR); Devin Alexander Mourey (Albany, OR)
Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
B41J2/145B41J2/14072B41J2/155B41J2/1603B41J2/1623B41J2/1632B41J2/1635B41J2/1637B41J2/2103B41J2002/14475B41J2002/14491B41J2202/20B41J2202/22
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Quick Facts
Patent No.
US 10,232,620
App. No.
15/747,639
Granted
Mar 19, 2019
Kind
B2
Abstract

A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.

Claims (21)

1. A printhead comprising:

a number of s-shaped dies embedded in a moldable substrate.

2. The printhead of claim 1 , further comprising at least one electrical interconnect coupled at one location to each of the s-shaped dies.

3. The printhead of claim 2 , wherein the number of s-shaped dies forms a medium-wide array.

4. The printhead of claim 1 , wherein the s-shaped dies each comprise a number columns of nozzles.

5. The printhead of claim 4 , wherein the number of columns of nozzles overlap and the overlapping nozzles cooperatively operate to eject ink to form an image on a substrate.

6. The printhead of claim 1 , wherein the electrical interconnects are coupled to a common circuit assembly.

7. The printhead of claim 1 , further comprising a number of ejection fluid feed slots wherein the ejection fluid feed slots provide a single type of ejection fluid to the number of s-shaped dies.

8. A medium-wide array, comprising:

a number of printheads, each printhead comprising:

a number of s-shaped dies; and

an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies.

9. The medium-wide array of claim 8 , further comprising a number of wirebond connections defined along a side of the s-shaped dies.

10. The medium-wide array of claim 8 , wherein the number of printheads equals the number of colors provided by a printing device implementing the number of printheads.

11. The medium-wide array of claim 8 , wherein the number of printheads each print two distinct types of ejection fluid via two sets of s-shaped dies each fed with a single ejection fluid feed slot.

12. An s-shaped die of a printhead, comprising:

a number of columns of nozzles; and

an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.

13. The s-shaped die of a printhead of claim 12 , further comprising an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped.

14. The s-shaped die of a printhead of claim 12 , wherein each end of the s-shaped die overlaps a set of nozzles of a separate s-shaped die.

15. The s-shaped die of a printhead of claim 12 , wherein the electrical interconnect couples to a side interconnect running parallel to a longitudinal axis of the s-shaped die.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2018
From: CUMBIE, MICHAEL W.; CHOY, SILAM J.; CHEN, CHIEN-HUA; MOUREY, DEVIN ALEXANDER
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 044854/0699 →
Continuity (1)
Related Publication 20180215147A1 · Aug 2, 2018