Glass composition, component, and method for producing a component

1. A glass composition comprising:

at least one tellurium oxide in a proportion of at least 65 mol. % and at most 90 mol. %;

R 1 O in a proportion between 10 mol. % and 20 mol. %, wherein R 1 is selected from the group consisting of Mg, Ca, Sr, Ba, Zn, Mn and combinations thereof;

at least one M 1 2 O in a proportion between 5 mol. % and 25 mol. %, wherein M 1 is selected from the group consisting of Li, Na, K and combinations thereof;

at least one R 2 2 O 3 in a proportion between 1 mol. % and 3 mol. %, wherein R 2 is selected from the group consisting of Al, Ga, In, Bi, Sc, Y, La, rare earths and combinations thereof;

M 2 O 2 in a proportion between 0 mol. % and 2 mol. %, wherein M 2 is selected from the group consisting of Ti, Zr, Hf and combinations thereof; and

R 3 2 O 5 in a proportion between 0 mol. % and 6 .%, wherein R 3 is selected from Nb and/or Ta,

wherein a sum of all proportions of tellurium oxide, M 1 2 O, R 2 2 O 3 , M 2 O 2 , R 3 2 O 5 and R 1 O in the glass composition is 100 mol. %, and

wherein the glass composition is free of boron trioxide, germanium oxide, phosphates, halides, P 2 O 5 , silicon dioxide and silicates.

2. The glass composition according to claim 1 , wherein the glass composition consists essentially of tellurium oxide, M 1 2 O, R 1 O and R 2 2 O 3 ,

wherein tellurium oxide is in a proportion of at least 65 mol. % and at most 90 mol. % present,

wherein R 1 O is in a proportion between 0 mol. % and 20 mol. % present,

wherein R 1 is selected from the group consisting of Mg, Ca, Sr, Ba, Zn, Mn and combinations thereof,

wherein M 1 2 O is in a proportion between 10 mol. % and 12 mol. % present, wherein M 1 is selected from the group consisting of Li, Na, K and combinations thereof,

wherein R 2 2 O 3 is in a proportion between 1.5 mol. % and 2 mol. % present, wherein R 2 is selected from the group consisting of Al, Ga, In, Bi, Sc, Y, La, rare earths and combinations thereof.

3. The glass composition according to claim 1 , wherein the tellurium oxide is TeO 2 and comprises a proportion of at least 67 mol. % and at most 69 mol. %.

4. The glass composition according to claim 1 , wherein R 1 O has a proportion of between 14 mol. % and 18 mol. %.

5. The Glass composition according to claim 1 , wherein M 1 2 O has a proportion of between 8 mol. % and 14 mol. %.

6. The glass composition according to claim 1 , wherein R 2 is selected from the group consisting of Al, La, Y and Bi, and wherein R 2 2 O 3 comprises a proportion between 1.5 mol. % and 2.5 mol. %.

7. The glass composition according to claim 1 , wherein the glass composition consists essentially of tellurium oxide, M 1 2 O, R 2 2 O 3 , and wherein R 2 2 O 3 comprises a proportion between 1.5 mol. % and 2 mol. %.

8. The glass composition according to claim 1 , wherein the glass composition has a glass transition temperature of less than 320° C. and has a dilatometric softening temperature of less than 400° C.

9. The glass composition according to claim 1 , wherein the glass composition is radiation-permeable so that at least 90% of an incident electromagnetic radiation from a wavelength range of 380 nm to 800 nm is transmitted.

10. A device comprising:

a first mounting element with a mounting surface;

the glass composition according to claim 1 ; and

a second mounting element,

wherein the glass composition is arranged between the mounting surface of the first mounting element and the second mounting element,

wherein the glass composition is formed as an adhesive layer, and

wherein the glass composition connects the mounting surface of the first mounting element and the second mounting element to one another.

11. The device according to claim 10 , wherein each of the first mounting element and the second mounting element is selected from a semiconductor chip, a ceramic, a silicate glass, a metal, a conversion ceramic, a lens or combinations thereof, and wherein the first mounting element and/or the second mounting element include a functional oxidic coating.

12. The device according to claim 10 , wherein the first mounting element is a semiconductor chip and the second mounting element is a transparent silicate glass, a converting ceramic or a transmitting ceramic.

13. The device according to claim 10 , wherein the first mounting element is a ceramic or a metal and the second mounting element is a ceramic.

14. A method for producing a device according to claim 10 , the method comprising:

providing the first mounting element comprising a mounting surface;

applying the glass composition directly to the mounting surface;

applying the second mounting element to the glass composition; and

heating the device to at most 400° C. so that a bond is produced between the mounting surface of the first mounting element and the glass composition and the second mounting element.

15. The method according to claim 14 , wherein applying the glass composition to the mounting surface of the first mounting element comprises applying the glass composition as a powder or preproduced body.

16. A glass consisting essentially of tellurium oxide, M 1 2 O, R 1 O and R 2 2 O 3 ,

wherein tellurium oxide is in a proportion of at least 65 mol. % and at most 90 mol. % present,

wherein R 1 O is in a proportion between 10 mol. % and 20 mol. % present,

wherein R 1 is selected from the group consisting of Mg, Ca, Sr, Ba, Zn, Mn and combinations thereof,

wherein M 1 2 O is in a proportion between 10 mol. % and 12 mol. % present, wherein M 1 is selected from the group consisting of Li, Na, K and combinations thereof,

wherein R 2 2 O 3 is in a proportion between 1.5 mol. % and 2 mol. % present, wherein R 2 is selected from the group consisting of Al, Ga, In, Bi, Sc, Y, La, rare earths and combinations thereof.