IP Library › Granted Patent US 10,233,125
Granted Patent B2
US 10,233,125 · App. 15/127,214 · Granted Mar 19, 2019

Aluminium-silicon carbide composite, and power-module base plate

Inventors: Daisuke Goto (Omuta, JP); Hideki Hirotsuru (Omuta, JP); Yoshitaka Taniguchi (Omuta, JP); Goh Iwamoto (Omuta, JP); Kazunori Koyanagi (Omuta, JP)
Assignee: DENKA COMPANY LIMITED
C04B35/806C04B41/009C04B41/5155C04B41/88H01L21/4871H01L23/3733C04B2111/00844C04B2235/3826C04B2235/402C04B2235/5264H01L2924/0002
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Quick Facts
Patent No.
US 10,233,125
App. No.
15/127,214
Granted
Mar 19, 2019
Kind
B2
Abstract

To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.

Claims (11)

1. An aluminum-silicon carbide composite comprising

a first phase comprising a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %; and

on a periphery of the first phase, a second phase comprising an aluminum-ceramic fiber composite containing, at a proportion of 3 to 20% by volume, ceramic fibers comprising alumina or silica and having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100;

wherein a proportion of the aluminum-ceramic fiber composite contained in the second phase is at least 50 area % of the peripheral area of the first phase.

2. The aluminum-silicon carbide composite according to claim 1 , wherein a thermal expansion coefficient of the aluminum-ceramic fiber composite is less than 20×10 −6 /K, a strength at 25° C. is at least 200 MPa and a strength at 150° C. is at least 150 MPa.

3. The aluminum-silicon carbide composite according to claim 1 , wherein both main surfaces of the first phase are covered by an aluminum alloy layer or an aluminum-ceramic fiber layer.

4. The aluminum-silicon carbide composite according to claim 1 , wherein one main surface of the first phase is covered by an aluminum alloy layer or an aluminum-ceramic fiber layer.

5. The aluminum-silicon carbide composite according to claim 1 , wherein a ceramic fiber content in the aluminum-ceramic fiber composite contained in the second phase is 5 to 20 vol % with respect to an entire aluminum-ceramic fiber composite.

6. The aluminum-silicon carbide composite according to claim 1 , wherein the ceramic fiber comprises one or more materials chosen from among alumina, silica, boron nitride, and silicon nitride.

7. A power-module base plate formed by plating a surface of the aluminum-silicon carbide composite according to claim 1 .

8. The aluminum-silicon carbide composite according to claim 1 , wherein the aluminum alloy layer has an average thickness of 0.05 mm to 0.3 mm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2016
From: GOTO, DAISUKE; HIROTSURU, HIDEKI; TANIGUCHI, YOSHITAKA; IWAMOTO, GOH; KOYANAGI, KAZUNORI
To: DENKA COMPANY LIMITED
Reel/Frame 039963/0929 →
Priority Claims (1)
JP 2014-054706 · Mar 18, 2014 · national
Continuity (1)
Related Publication 20170107158A1 · Apr 20, 2017
Cited By (1)
US 12,698,621