Supporting unit and substrate treatment apparatus
Provided is a supporting unit supporting a substrate. The supporting unit includes a body including a plurality of heating regions and disposed with the substrate on a top surface thereof and a heating unit heating the body. Herein, the heating unit includes heating lines provided in the plurality of heating regions, respectively, to control temperatures of the plurality of heating regions independently from one another, terminals provided to the body and receiving power from the outside, and connecting lines connecting the heating lines to the terminals mutually corresponding to one another. Also, the terminals are disposed in one of the plurality of heating regions in a top view.
1. A supporting unit for supporting a substrate, comprising:
a body including a plurality of heating regions defined thereon, the body configured to receive the substrate on a top surface thereof; and
a heater configured to heat the body, the heater including,
heating lines in the body and corresponding to the plurality of heating regions, respectively,
terminals at the body, the terminals configured to receive power from outside, each of the terminals corresponding to one of the plurality of heating regions in a top view, an entirety of the terminals in a single region from among the plurality of heating region, and
connecting lines each connecting one of the heating lines to a corresponding one of the terminals,
wherein the heating lines are configured to control temperatures of the plurality of heating regions independently from one another by the power delivered from the terminals via the connecting lines,
the plurality of heating regions comprise a central portion and one or a plurality of edge portions surrounding the central portion,
the terminals are in the central portion,
the body further comprises a cooling flow channel for cooling down the body, and
the terminals overlap with the cooling flow channel in the top view.
2. The supporting unit of claim 1 , wherein the connecting lines are in the body.
3. A substrate treatment apparatus comprising:
a chamber having an inner space;
a supporting unit in the chamber, the supporting unit configured to support a substrate;
a gas supplier configured to supply a processing gas into the chamber; and
a plasma source generator configured to generate plasma from the processing gas,
wherein the supporting unit includes,
a body including a plurality of heating regions defined thereon, the body configured to receive the substrate on a top surface thereof; and
a heater configured to heat the body, the heater including,
heating lines in the body and corresponding to the plurality of heating regions, respectively,
terminals at the body, the terminals configured to receive power from outside, each of the terminals corresponding to one of the plurality of heating regions in a top view, an entirety of the terminals in a single region from among the plurality of heating region, and
connecting lines each connecting one of the heating lines to a corresponding one of the terminals,
wherein the heating lines are configured to control temperatures of the plurality of heating regions independently from one another by the power delivered from the terminals via the connecting lines,
the plurality of heating regions comprise a central portion and one or a plurality of edge portions surrounding the central portion,
the terminals are in the central portion,
the body further comprises a cooling flow channel for cooling down the body, and
the terminals overlap with the cooling flow channel in the top view.
4. The apparatus of claim 3 , wherein the connecting lines are in the body.
5. A supporting unit comprising:
a ceramic puck including an electrode and heating lines, the electrode configured to receive a substrate thereon using an electrostatic force, the heating lines configured to heat the substrate;
a cooling plate on a bottom of the ceramic puck, the cooling plate including a cooling flow channel for cooling down the substrate; and
a bonding layer between the ceramic puck and the cooling plate, the bonding layer bonding the ceramic puck to the cooling plate,
wherein the ceramic puck further includes,
a plurality of heating regions defined thereon,
the heating lines corresponding to the plurality of heating regions, respectively,
terminals at the ceramic puck, the terminals connected to the heating lines and configured to receive power from outside, an entirety of the terminals in a single region from among the plurality of heating regions, and
connecting lines each connecting one of the heating lines to a corresponding one of the terminals, and
wherein the heating lines are configured to control temperatures of the plurality of heating regions independently from one another by the power delivered from the terminals via the connecting lines,
the plurality of heating regions comprise a central portion and one or a plurality of edge portions surrounding the central portion,
the terminals are in the central portion, and
the terminals overlap with the cooling flow channel in a top view.
6. The supporting unit of claim 5 , wherein the ceramic punk further includes connecting lines, each of which connects one of the heating lines to a corresponding one of the terminals.