Multilayer electronic component
A multilayer body includes a first pattern conductor, and first and second via conductors. A first end of the first via conductor is electrically coupled with a second signal electrode, and a second end thereof is electrically coupled with the first pattern conductor. A first end of the second via conductor is electrically coupled with the first pattern conductor. The first pattern conductor extends such that a distance between the second via conductor and a second shield electrode is smaller than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is smaller than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is outside an area of the second signal electrode.
1. A multilayer electronic component, comprising:
a multilayer body that is an electronic component element body;
a shield electrode; and
an outer electrode including a signal electrode and a ground electrode; wherein
the multilayer body has a rectangular-parallelepiped or substantially rectangular-parallelepiped shape including a first principal surface, a second principal surface, and four side surfaces connecting the first principal surface with the second principal surface, and includes therein a first pattern conductor parallel or substantially parallel to the first principal surface and the second principal surface, and a first via conductor and a second via conductor perpendicular or substantially perpendicular to the first principal surface and the second principal surface;
the shield electrode is provided on at least one of the side surfaces;
the outer electrode is provided on the second principal surface;
a first end of the first via conductor is electrically coupled with the signal electrode within an area of the signal electrode, and a second end of the first via conductor is electrically coupled with the first pattern conductor on a side of the second principal surface;
a first end of the second via conductor is electrically coupled with the first pattern conductor on a side of the first principal surface; and
the first pattern conductor extends such that, in a view from the first principal surface, a distance between the second via conductor and the shield electrode is smaller than a distance between the first via conductor and the shield electrode, and at least a portion of a coupling portion between the second via conductor and the first pattern conductor is outside the area of the signal electrode with which the first via conductor is electrically coupled.
2. The multilayer electronic component according to claim 1 , wherein a length of the second via conductor is larger than a length of the first via conductor.
3. The multilayer electronic component according to claim 1 , wherein the multilayer body further includes a second pattern conductor parallel or substantially parallel to the first principal surface and the second principal surface, the second pattern conductor is electrically coupled with a second end of the second via conductor on the side of the second principal surface, and the second pattern conductor defines an inductor or a capacitor.
4. The multilayer electronic component according to claim 1 , wherein the shield electrode includes four shield electrodes respectively provided on each of the four side surfaces.
5. The multilayer electronic component according to claim 1 , wherein
the multilayer body includes a third pattern conductor parallel or substantially parallel to the first principal surface and the second principal surface, and a third via conductor perpendicular or substantially perpendicular to the first principal surface and the second principal surface;
a first end of the third via conductor is electrically coupled with the ground electrode within an area of the ground electrode, and a second end of the third via conductor is electrically coupled with the third pattern conductor on the side of the second principal surface; and
an end of the third pattern conductor is electrically coupled with the shield electrode.
6. The multilayer electronic component according to claim 1 , wherein
the shield electrode includes a first portion and a second portion including a first end electrically coupled with the first portion and a second end reaching the second principal surface;
the ground electrode includes a first portion and a second portion including a first end electrically coupled with the first portion and a second end reaching the side surface provided with the second portion of the shield electrode; and
the second portion of the shield electrode is electrically coupled with the second portion of the ground electrode.
7. The multilayer electronic component according to claim 5 , wherein the third pattern conductor includes two third pattern conductors.
8. The multilayer electronic component according to claim 5 , wherein the shield electrode includes four shield electrodes respectively provided on each of the four side surfaces.
9. The multilayer electronic component according to claim 7 , wherein
the shield electrode is defined by four shield electrodes respectively provided on each of the four side surfaces; and
one of the two third pattern conductors is connected to one of the four shield electrodes and another one of the two third pattern conductors is connected to another one of the four shield electrodes.
10. The multilayer electronic component according to claim 9 , wherein the one of the four shield electrodes is provided on a side of the multilayer body opposite to a side of the multilayer body on which the another one of the four shield electrodes is provided.
11. The multilayer electronic component according to claim 1 , wherein the first via conductor and the second via conductor are arranged in a straight line parallel or substantially parallel to at least one of the four side surfaces.
12. The multilayer electronic component according to claim 1 , wherein the first via conductor and the second via conductor are spaced away from one of the four side surfaces by an equal distance.
13. The multilayer electronic component according to claim 1 , wherein the ground electrode includes a plurality of ground electrodes.
14. The multilayer electronic component according to claim 5 , wherein the ground electrode includes a plurality of ground electrodes.
15. The multilayer electronic component according to claim 14 , wherein the third pattern conductor includes two third pattern conductors.
16. The multilayer electronic component according to claim 14 , wherein the shield electrode includes four shield electrodes respectively provided on each of the four side surfaces.
17. The multilayer electronic component according to claim 15 , wherein
the shield electrode includes four shield electrodes respectively provided on each of the four side surfaces; and
one of the two third pattern conductors is connected to one of the four shield electrodes and another one of the two third pattern conductors is connected to another one of the four shield electrodes.
18. The multilayer electronic component according to claim 17 , wherein the one of the four shield electrodes is provided on a side of the multilayer body opposite to a side of the multilayer body on which the another one of the four shield electrodes is provided.
19. The multilayer electronic component according to claim 1 , wherein the signal electrode includes a plurality of signal electrodes.
20. The multilayer electronic component according to claim 6 , wherein the signal electrode includes a plurality of signal electrodes.