Apparatus for direct transfer of semiconductor devices with needle retraction support
An apparatus, for attaching a semiconductor device die to a circuit substrate, includes an elongated rod to press a holding substrate carrying the semiconductor device die into a position at which the semiconductor device die attaches to the circuit substrate; and a support including a base portion having a hole via which the elongated rod passes when actuated to press the holding substrate.
1. An apparatus for transferring an unpackaged LED from a first substrate to a second substrate, the first substrate having a first side and a second side, and the unpackaged LED being disposed on the first side of the first substrate, the apparatus comprising:
a first frame to hold the first substrate;
a second frame to hold the second substrate adjacent to the first side of the first substrate;
a needle to move, during a transfer process, to a transfer position at which the needle contacts the second side of the first substrate to press the first substrate such that the unpackaged LED is released from the first substrate and is attached to the second substrate; and
a needle retraction support including a base portion having a plurality of perforations, via at least one of which the needle passes during the transfer process,
wherein a tip of the needle has a width corresponding to a width of the unpackaged LED.
2. The apparatus according to claim 1 , wherein at least one of the first frame or the second frame are controlled by a computing device to be oriented such that the unpackaged LED on the first substrate is aligned with a transfer location on the second substrate.
3. The apparatus according to claim 1 , wherein the needle retraction support is thermally regulated.
4. The apparatus according to claim 1 , wherein one of the first frame or the second frame is movable in at least two directions.
5. The apparatus according to claim 1 , further comprising a needle actuator configured to actuate the needle to transfer multiple unpackaged LED consecutively at a rate of at least six per second.
6. The apparatus according to claim 1 , further comprising a controller configured to orient the unpackaged LED to the transfer position that aligns with a circuit trace on the second substrate.
7. An apparatus for transferring an unpackaged LED from a first substrate to a second substrate, the first substrate having a first side and a second side, and the unpackaged LED being disposed on the first side of the first substrate, the apparatus comprising:
a first frame to hold the first substrate;
a second frame to hold the second substrate adjacent to the first side of the first substrate;
a needle to move, during a transfer process, to a transfer position at which the needle contacts the second side of the first substrate to press the first substrate such that the unpackaged LED is released from the first substrate and is attached to the second substrate;
a needle actuator configured to actuate the needle to transfer multiple unpackaged LEDs consecutively at a rate of at least six per second; and
a needle retraction support including a base portion having a plurality of perforations, via at least one of which the needle passes during the transfer process.
8. The apparatus according to claim 7 , wherein at least one of the first frame or the second frame are controlled by a computing device to be oriented such that the unpackaged LED on the first substrate is aligned with a transfer location on the second substrate.
9. The apparatus according to claim 7 , wherein the needle retraction support is thermally regulated.
10. The apparatus according to claim 7 , wherein one of the first frame or the second frame is movable in at least two directions.
11. The apparatus according to claim 7 , further comprising a controller configured to orient the unpackaged LED to the transfer position that aligns with a circuit trace on the second substrate.