IP Library › Granted Patent US 10,247,378
Granted Patent B2
US 10,247,378 · App. 15/745,363 · Granted Apr 2, 2019

Metal PCB, headlight module having metal PCB applied thereto, and method for assembling headlight module

Inventor: Chang-Won Kim (Busan, KR)
Assignee: ECOCAB.CO., LTD
F21S41/192F21S41/141F21S43/14F21S43/195F21S45/47F21V29/503F21V29/89H01L23/5387H01L25/0753H01L33/62H01L33/64H01L33/641H01L33/647H05K1/02H05K1/05H05K1/18F21Y2115/10H01L2933/0066H01L2933/0075
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Quick Facts
Patent No.
US 10,247,378
App. No.
15/745,363
Granted
Apr 2, 2019
Kind
B2
Abstract

Provided are a metal PCB, a headlight module having the metal PCB applied thereto, and a method for assembling the headlight module, wherein the metal PCB has a base made of a metal material and configured as a thin plate, or the base has a predetermined thickness and is bent in a desired direction through a bending groove formed on the rear surface thereof, and the base has a plurality of chip mounting portions integrated thereon such that one or more LED chips are mounted thereon, the chip mounting portions being spaced at a predetermined interval and having at least two parts of incision surfaces formed on one side of the base such that the chip mounting portions are inclined and installed to have a predetermined angle with regard to the base.

Claims (35)

1. A headlight module comprising:

a back plate having a body extended in a specific length in accordance with a headlight housing; and

a metal PCB connected to the back plate and having a plurality of LED chips mounted thereon through patterns integrated with the metal PCB, the metal PCB being coupled with the back plate through a coupler, wherein the patterns are formed on a base made of metal, and chip mounting parts having the LED chips mounted thereon are disposed to be bent,

wherein a coupling part of the back plate coupled to the headlight housing is provided at a bottom of the body and a plurality of consecutive support surfaces is provided on the back plate,

wherein a plurality of board mounting parts having identical or different slopes are integrated and protruded from respective tops of the plurality of consecutive support surfaces, and

wherein each of the chip mounting parts is bent at a specific angle with respect to the base through a cut face on the base.

2. A method of assembling a headlight module, comprising steps of:

preparing a metal PCB which includes patterns so that a plurality of LED chips is mounted on a base made of metal equipped with bending grooves for multi-faced bending at a bottom of the base, wherein a plurality of chip mounting parts is banked so that angles of the LED chips are relatively adjusted with respect to the metal PCB;

preparing a back plate in which board mounting parts, each one having a slope corresponding to the respective chip mounting part, protrude forward from support surfaces; and

coupling the chip mounting parts of the metal PCB to the back plate in an inclined state through a coupler when the metal PCB is coupled to a top of the back plate,

wherein the coupler, the board mounting parts, and the support surfaces are integrated in the back plate through a mold,

a downward location determination jaw and an upward location determination jaw preventing a downward and upward movement of each of the bent chip mounting parts, respectively, are integrated in each of the support surfaces so that an angle of each of the chip mounting parts is adjusted and firmly fixed when the metal PCB is coupled, and

the coupler includes a hook to couple the back plate and the metal PCB.

3. The method of claim 2 , wherein the chip mounting parts and the mounting surfaces are simultaneously formed on the metal PCB by pressing the chip mounting parts and the mounting surfaces using the mold formed to correspond to the board mounting parts and the support surfaces in the back plate.

4. The method of claim 2 , wherein the chip mounting parts are formed by blanking at least one side of the metal PCB by a pair of blanking molds in a state in which the patterns have been connected.

5. A headlight module, comprising:

a back plate having a body extended in a specific length in accordance with a headlight housing; and

a metal PCB connected to the back plate and having a plurality of LED chips mounted thereon through patterns integrated with the metal PCB, the metal PCB being coupled with the back plate through a coupler, wherein the patterns are formed on a base made of metal and chip mounting parts having the LED chips mounted thereon are disposed to be bent,

wherein a coupling part of the back plate coupled to the headlight housing is provided at a bottom of the body and a plurality of consecutive support surfaces is provided on the back plate,

wherein a plurality of board mounting parts having identical or different slopes are integrated and protruded from respective tops of the plurality of consecutive support surfaces, and

wherein the coupler includes a latching hook and a fixing hook, each having an inclined surface thereon, and each of the latching hook and the fixing hook is coupled to a support jaw protruding from one side of the metal PCB.

6. The headlight module of claim 5 , wherein each of the board mounting parts comprises:

a triangular block protruding from the back plate to have a slope on the respective support surface, and

a fixed jaw disposed on one side of the triangular block to prevent an upward motion of the metal PCB.

7. The headlight module of claim 5 , wherein each of the board mounting parts comprises:

triangular walls spaced apart from each other and each protruding from the back plate to have a slope,

a downward location determination jaw disposed on an inside of each triangular wall, and

an upward location determination jaw disposed on one side of each triangular wall.

8. The headlight module of claim 7 , wherein each of the board mounting parts further comprises:

guide protrusions protruding on an inside of each triangular wall to be coupled to the guide holes.

9. The headlight module of claim 5 , wherein the back plate has an air flow hole depressed and formed in a portion coming into contact with the metal PCB.

10. The headlight module of claim 5 , wherein the metal PCB is a thin plate shape bending through a plurality of bending grooves provided at a bottom of the chip mounting part, and

wherein the plurality of the bending grooves are arranged to be parallel to each other or to form a triangle, and one of the plurality of the bending grooves has one of V, U and C shapes.

11. The headlight module of claim 5 , wherein one of the plurality of consecutive support surfaces is a stepped shape configuration or a configuration of an inclined shape having a different angle.

12. The headlight module of claim 5 , wherein the metal PCB has a configuration in which a flexible board having the LED chips is bonded to a top of a heat-dissipation plate made of aluminum.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2018
From: KIM, CHANG-WON
To: ECOCAB.CO.,LTD
Reel/Frame 044631/0046 →
Priority Claims (6)
KR 10-2015-0190931 · Dec 31, 2015 · national
KR 10-2015-0190933 · Dec 31, 2015 · national
KR 10-2015-0190941 · Dec 31, 2015 · national
KR 10-2016-0147369 · Nov 7, 2016 · national
KR 10-2016-0147372 · Nov 7, 2016 · national
KR 10-2016-0147373 · Nov 7, 2016 · national
Continuity (1)
Related Publication 20180209604A1 · Jul 26, 2018