Measuring individual device degradation in CMOS circuits
View Patent ↗Methods and systems for measuring degradation includes measuring an initial electrical characteristic of a test device in a ring oscillator that includes multiple oscillator stages, each having a delay stage and one or more fan-out devices, and a test stage having a delay stage and the test device. The ring oscillator is operated for a period of time. The electrical characteristic of the test device is measured after operating the ring oscillator. A level of degradation in the test device is determined using a processor based on the measurements of the electrical characteristic of the test device.
1. A test oscillator, comprising:
a plurality of oscillator stages, with each stage comprising a delay stage and one or more fan-out devices to simulate a load; and
a test stage, comprising a delay stage and a test device having an input terminal connected to a source or drain of a transistor of the test device, for measuring one or more electrical properties of the test device,
wherein the plurality of oscillator stages and the test stage are arranged linearly, with a final stage feeding back into a first stage to provide oscillation.
2. The test oscillator of claim 1 , further comprising an enable switch configured to receive the output of the final stage and to provide the output as an input to the final stage if an enable signal is present.
3. The test oscillator of claim 1 , wherein the delay stages are inverters.
4. The test oscillator of claim 1 , wherein the fan-out devices are inverters.
5. The test oscillator of claim 4 , wherein the fan-out devices have a floating output.
6. The test oscillator of claim 1 , wherein the test device comprises a p-type field effect transistor and an n-type field effect transistor.
7. The test oscillator of claim 6 , wherein one of the field effect transistors of the test device has a gate input that is biased in a reverse direction from a drain input during operation.
8. The test oscillator of claim 6 , wherein both field effect transistors are stressed during operation.
9. A method of measuring degradation, comprising:
measuring an initial electrical characteristic of a test device in a ring oscillator that comprises a plurality of oscillator stages, each having a delay stage and one or more fan-out devices, and a test stage having a delay stage and the test device;
operating the ring oscillator for a period of time;
measuring the electrical characteristic of the test device after operating the ring oscillator; and
determining a level of degradation in the test device using a processor based on the measurements of the electrical characteristic of the test device.
10. The method of claim 9 , further repeating said steps of operating the ring oscillator and measuring the electrical characteristic of the test device multiple times before determining the level of degradation.
11. The method of claim 10 , further comprising fitting a curve to the measurements of the electrical characteristic of the test device.
12. The method of claim 11 , further comprising extrapolating the measurements of the electrical characteristic of the test device into the future using the curve.
13. The method of claim 11 , wherein the curve has a functional form of At n , where A is a parameter that is a function of voltage and temperature, t is time, and n is a power factor that characterizes a type of degradation.
14. The method of claim 9 , further comprising:
measuring an initial frequency of the ring oscillator; and
measuring the frequency of the ring oscillator after operating the ring oscillator.
15. A system for measuring degradation, comprising:
a test device interface configured to measuring an initial electrical characteristic of a test device in a ring oscillator that comprises a plurality of oscillator stages, each having a delay stage and one or more fan-out devices, and a test stage having a delay stage and the test device, to operate the ring oscillator for a period of time, and to measure the electrical characteristic of the test device after operating the ring oscillator; and
an analysis module comprising a processor configured to determine a level of degradation in the test device using a processor based on the measurements of the electrical characteristic of the test device.
16. The system of claim 15 , wherein the test device interface is further configured to repeat operation of the ring oscillator and measurement of the electrical characteristic of the test device multiple times before determining the level of degradation.
17. The system of claim 16 , wherein the analysis module is further configured to fit a curve to the measurements of the electrical characteristic of the test device.
18. The system of claim 17 , wherein the analysis module is further configured to extrapolate the measurements of the electrical characteristic of the test device into the future using the curve.
19. The system of claim 17 , wherein the curve has a functional form of At n , where A is a parameter that is a function of voltage and temperature, t is time, and n is a power factor that characterizes a type of degradation.
20. The system of claim 15 , wherein the test device interface is further configured to measure an initial frequency of the ring oscillator and to measure the frequency of the ring oscillator after operating the ring oscillator.