Maintenance operations in a DRAM
A system includes a memory controller and a memory device having a command interface and a plurality of memory banks, each with a plurality of rows of memory cells. The memory controller transmits an auto-refresh command to the memory device. Responsive to the auto-refresh command, during a first time interval, the memory device performs refresh operations to refresh the memory cells and the command interface of the memory device is placed into a calibration mode for the duration of the first time interval. Concurrently, during at least a portion of the first time interval, the memory controller performs a calibration of the command interface of the memory device. The auto-refresh command may specify an order in which memory banks of the memory device are to be refreshed, such that the memory device sequentially refreshes a respective row in the plurality of memory banks in the specified bank order.
1. A dynamic random access memory (DRAM) device comprising:
a plurality of banks each including DRAM memory cells;
an on-die termination circuit having a termination resistance;
an output driver to transmit data, the output driver having an output drive strength;
a command interface to receive a refresh command from a memory controller, wherein the refresh command specifies a refresh operation of the plurality of banks, the refresh operation to occur during a time interval; and
a circuit to perform a calibration operation of the termination resistance and the output drive strength during the time interval and in response to the refresh command.
2. The DRAM device of claim 1 , wherein the calibration operation of the termination resistance and the output drive strength is performed during the time interval as specified by an operation code received at the command interface, wherein the operation code is received with the refresh command.
3. The DRAM device of claim 1 , wherein the refresh command includes a plurality of bits to identify at least one bank as a first bank of the plurality of banks to be refreshed in a sequence in response to the refresh command.
4. The DRAM device of claim 1 , wherein the refresh operation is specified as an auto-refresh operation, wherein a row of memory cells is refreshed in the at least one bank identified by the plurality of bits.
5. The DRAM device of claim 1 , further comprising control logic configured to enable the command interface to perform a calibration operation of the command interface while performing the refresh operation.
6. The DRAM device of claim 5 , wherein the calibration operation of the command interface is being specified by an operation code received at the command interface, wherein the operation code is received with the refresh command.
7. The DRAM device of claim 6 , wherein the calibration operation of the command interface includes placing the command interface into a loopback mode, wherein the DRAM further comprises a circuit to receive a calibration pattern from a memory controller on a first path and transmit data on a second path during the calibration operation, the data representing the calibration pattern as received from the memory device.
8. The DRAM device of claim 1 , further comprising a pad to couple to an external reference resistor, wherein the circuit to perform the calibration operation uses the reference resistor to set the termination resistance and the output drive strength.
9. The DRAM device of claim 1 , further comprising a circuit perform an offset voltage calibration by determining a value representing a receiver voltage offset for a sampler of the memory device and storing the value in the memory device.
10. A dynamic random access memory (DRAM) device comprising:
a plurality of banks each including DRAM memory cells;
an on-die termination circuit having a termination resistance;
an output driver to transmit data, the output driver having an output drive strength;
a command interface to receive a refresh command from a memory controller, wherein the refresh command specifies a refresh operation of the plurality of banks; and
a circuit to perform a calibration operation of the termination resistance and the output drive strength in response to the refresh command.
11. The DRAM device of claim 10 , wherein the calibration operation is to be performed in response to the refresh command as specified by operation code bits and in response to the refresh command.
12. The DRAM device of claim 11 , wherein the operation code bits are received along with the refresh command.
13. The DRAM device of claim 10 , wherein the refresh operation is to occur during a time interval wherein the calibration operation of the termination resistance and the output drive strength is performed during the time interval as specified by an operation code received at the command interface, wherein the operation code is received with the refresh command.
14. The DRAM device of claim 10 , wherein the refresh command includes a plurality of bits to identify at least one bank as a first bank of the plurality of banks to be refreshed in a sequence in response to the refresh command.
15. The DRAM device of claim 10 , wherein the refresh operation is specified as an auto-refresh operation, wherein a row of memory cells is refreshed in the at least one bank identified by the plurality of bits.
16. The DRAM device of claim 10 , further comprising control logic configured to enable the command interface to perform a calibration operation of the command interface while performing the refresh operation.
17. The DRAM device of claim 16 , further comprising a pad to couple to an external reference resistor, wherein the circuit to perform the calibration operation uses the reference resistor to set the termination resistance and the output drive strength.
18. A method of operation in a dynamic random access memory (DRAM) device comprising a plurality of banks each including DRAM memory cells, the method comprising:
receiving a refresh command from a memory controller, wherein the refresh command specifies a refresh operation of the plurality of banks; and
in response to the refresh command, performing a calibration operation of a termination resistance of an on-die termination circuit and an output drive strength of an output driver.
19. The method of claim 18 , wherein the calibration operation is to be performed in response to the refresh command as specified by an operation code bits and in response to the refresh command.
20. The method of claim 19 , wherein the operation code bits are received along with the refresh command.