Circuit board and conductive pattern structure

1. A circuit board comprising:

a first conductive layer;

a second conductive layer; and

an insulating layer disposed between the first conductive layer and the second conductive layer,

wherein the first conductive layer comprises a signal line, the second conductive layer comprises a ground line electrically separated from the signal line, in a corresponding area provided with the signal line and the ground line, the ground line is patterned, and

wherein an outer unit pattern of the ground line is substantially parallel to the signal line and an inner unit pattern of the ground line is oblique to the signal line.

2. The circuit board of claim 1 , wherein the ground line comprises a pattern area patterned in a meander shape such that changing a position of the signal line within the corresponding area results in an impedance change of 1Ω or less.

3. The circuit board of claim 2 , wherein changing a position of the signal line within the corresponding area comprises a lateral displacement across the ground line.

4. The circuit board of claim 1 , wherein a shape of a unit pattern of the ground line under the signal line is substantially the same regardless of a position of the signal line within the corresponding area.

5. The circuit board of claim 1 , wherein, in the corresponding area provided with the signal line and the ground line, a return path of the ground line corresponding to the signal line remains substantially the same regardless of a position of the signal line.

6. The circuit board of claim 1 , wherein the ground line comprises a pattern area patterned in an oblique meander shape.

7. The circuit board of claim 1 , wherein the second conductive layer further comprises dummy patterns, and the dummy patterns are not connected to the ground line.

8. A circuit board comprising:

a first conductive layer;

a second conductive layer; and

an insulating layer disposed between the first conductive layer and the second conductive layer,

wherein the first and second conductive layers comprise a signal line and a ground line, respectively, outer unit patterns are disposed along edge portions of the ground line, inner unit patterns are disposed between the outer unit patterns, and each of the outer unit patterns connect the inner unit patterns to one another,

wherein the ground line and the signal line are electrically separate from each other, and

wherein an outer unit pattern of the ground line is substantially perpendicular to the signal line.

9. The circuit board of claim 8 , wherein the outer unit patterns have an opened curve shape, and the inner unit patterns have an obliquely inclined shape, the outer unit patterns and the inner unit patterns being connected to each other to form a return path of the ground line.

10. The circuit board of claim 8 , wherein the inner unit patterns have an obliquely inclined shape with a constant width.

11. The circuit board of claim 8 , wherein the inner unit patterns are disposed with a constant interval therebetween.

12. The circuit board of claim 8 , wherein the inner unit patterns comprise obliquely inclined stripes aligned along substantially the same direction.

13. The circuit board of claim 8 , wherein the second conductive layer further comprises dummy patterns, and the dummy patterns are disposed between the outer unit patterns and the inner unit patterns.

14. A circuit board comprising:

a first conductive layer comprising a signal line;

a second conductive layer comprising a ground line; and

an insulating layer disposed between the first conductive layer and the second conductive layer,

wherein the ground line comprises a pattern area in which the ground line intersects the signal line in a plan view in a plurality of passes across the signal line, a current direction in the ground line alternates in the plurality of passes across the signal line, the ground line and the signal line are electrically separate from each other, and

wherein an outer unit pattern of the ground line is substantially parallel to the signal line and an inner unit pattern of the ground line is oblique to the signal line.

15. The circuit board of claim 14 , wherein the plurality of passes across the signal line comprise a first pass and a second pass across the signal line, and

the current direction across the first pass is configured to be substantially opposite to the current direction across the second pass.

16. The circuit board of claim 14 , wherein the ground line is patterned in an oblique meander shape in the pattern area.

17. The circuit board of claim 14 , wherein the current direction in the ground line does not change when a position of the signal line changes within a corresponding area of the ground line.

18. A conductive pattern structure for a circuit board, the conductive pattern structure comprising:

outer conductive patterns disposed along edge portions of a pattern area; and

inner conductive patterns disposed in the pattern area and connected to one another via the outer conductive patterns to form a conductive path having a meander shape,

wherein the inner conductive patterns comprise a first inner conductive pattern separated from a second inner conductive pattern, and

wherein the outer conductive patterns are parallel to the edge portions and the inner conductive patterns are oblique to the edge portions.

19. The conductive pattern structure of claim 18 , wherein the inner conductive patterns comprise obliquely inclined conductive stripes that are connected via the outer conductive patterns to form an oblique meander shape.

20. The conductive pattern structure of claim 18 , wherein the first inner conductive pattern and the second inner conductive pattern are disposed parallel to each another such that a current direction through the first inner conductive pattern and a current direction through the second inner conductive pattern are opposite to each other.