Nonvolatile memory device and method for fabricating the same
A nonvolatile memory device includes a substrate comprising a first word line formation area, a second word line formation area, and a support area interposed between the first and second word line formation areas; a first stacked structure disposed over the substrate of each of the first and second word line formation areas and having a plurality of interlayer dielectric layers and a plurality of conductive layers that are alternately stacked therein; a second stacked structure disposed over the substrate of the support area and having the plurality of interlayer dielectric layers and a plurality of spaces that are alternately stacked therein; a channel layer disposed in the first stacked structure; and a memory layer interposed between the channel layer and each of the plurality of conductive layers.
1. A method for fabricating a nonvolatile memory device, comprising:
forming a stacked structure over a substrate, the stacked structure including a plurality of interlayer dielectric layers and a plurality of conductive layers that are alternately stacked;
etching the stacked structure to such a depth to pass through at least a lowermost conductive layer by using a mask pattern as an etch barrier, wherein the mask pattern covers a first word line formation area, a second word line formation area, and a support area interposed between the first and second word, line formation areas; and
removing parts of the plurality of conductive layers so that the plurality of conductive layers in the first and second word line formation areas remain while the plurality of conductive layers in the support area are remove,
wherein the plurality of interlayer dielectric layers are further positioned at the support area corresponding to a portion between the first and second word line formation areas and serve as a support for preventing the stacked structure of the first and second word line formation areas from leaning.
2. The method of claim 1 , wherein the first and second word line, formation areas are extended in a second direction,
the support area is positioned between the first and second word line formation areas in a first direction crossing the second direction, and
the width of each of the first and second word line formation areas in the first direction is larger than the width, of the support area in the second direction.
3. The method of claim 1 , further comprising forming a channel layer connected to a part of the substrate through the stacked structure in the first and second word line formation areas.
4. The method of claim 3 , wherein the forming of the channel layer comprises:
selectively etching the stacked structure to form a channel hole that expose the part of the substrate; and
filling the channel hole with a material forming the channel layer, and
the method further comprises forming a memory layer on sidewalls of the channel hole, before the filling of the channel hole.
5. The method of claim 1 , wherein the removing of the parts of the conductive layers is performed through wet etching.
6. The method of claim 1 , further comprising performing a selective deposition process using the conductive layers as a seed layer after the removing of the part of the conductive layers.