Semiconductor devices having vertical transistors with aligned gate electrodes
A semiconductor device includes an active pillar on a substrate. A first source/drain region is disposed at a top end of the active pillar and has a greater width than the active pillar. A first insulating layer is disposed on a sidewall of the active pillar and a second insulating layer is disposed on at least a bottom surface of the first source/drain region. A gate electrode is disposed on the first insulating layer and the second insulating layer. A second source/drain region is disposed in the substrate at a bottom end of the active pillar. Methods of fabrication are also described.
1. A semiconductor device comprising:
an active pillar on a substrate;
a first source/drain region at a top end of the active pillar and having a greater width than the active pillar;
a first insulating layer on a sidewall of the active pillar;
a second insulating layer on at least a bottom surface of the first source/drain region;
a gate electrode on the first insulating layer and the second insulating layer and extending onto a sidewall of the first source/drain region; and
a second source/drain region in the substrate at a bottom end of the active pillar.
2. The semiconductor device of claim 1 , wherein the second insulating layer extends onto a sidewall of the first source/drain region.
3. The semiconductor device of claim 1 , wherein the gate electrode extends onto the substrate and wherein the semiconductor device further comprises a third insulating layer disposed between the gate electrode and the substrate and thicker than the second insulating layer.
4. The semiconductor device of claim 3 , wherein the third insulating layer comprises an oxide layer and a nitride layer.
5. The semiconductor device of claim 1 , further comprising an upper electrode on and electrically connected to the first source/drain region and spaced apart from the gate electrode.
6. The semiconductor device of claim 5 , wherein the active pillar includes a plurality of active pillars and the first source/drain region includes a plurality of first source/drain regions respectively disposed on the active pillars and wherein the upper electrode contacts the plurality of first source/drain regions.
7. The semiconductor device of claim 5 , wherein the active pillar includes a plurality of active pillars and the first source/drain region includes a plurality of first source/drain regions respectively disposed on the active pillars, and wherein the semiconductor device further comprises:
a mask pattern between the active pillars; and
a third insulating layer on a top surface and a sidewall of the mask pattern, filling a space between the first source/drain regions, and in contact with the upper electrode.
8. The semiconductor device of claim 5 , wherein the active pillar includes a plurality of active pillars and the first source/drain region includes a plurality of first source/drain regions respectively disposed on the active pillars, and wherein the semiconductor device further comprises:
a third insulating layer disposed between the active pillars and between the first source/drain regions and in contact with the upper electrode; and
a fourth insulating layer on the third insulating layer and in contact with a sidewall of the upper electrode.
9. The semiconductor device of claim 1 , further comprising a high-k dielectric layer between the gate electrode and the first and second insulating layers.
10. The semiconductor device of claim 1 , wherein the active pillar includes a plurality of active pillars and wherein the gate electrode extends on to sidewalls of the plurality of active pillars.
11. A semiconductor device comprising:
a semiconductor pillar;
a source/drain region adjoining an end of the semiconductor pillar and having a width greater than a width of the semiconductor pillar;
a first insulating layer on a sidewall of the semiconductor pillar;
a second insulating layer on a surface of the source/drain region adjacent the sidewall of the semiconductor pillar; and
a gate electrode on the first and second insulating layers and extending onto a sidewall of the source/drain region.
12. The semiconductor device of claim 11 , wherein the second insulating layer extends onto a sidewall of the source/drain region.
13. The semiconductor device of claim 11 , further comprising a third insulating layer interposed between the gate electrode and the first and second insulating layers.
14. The semiconductor device of claim 13 , wherein the third insulating layer comprises a metal oxide layer.