LED device, LED module and ultraviolet light emitting device
An LED device is provided which includes a substrate, an LED element disposed on the substrate, an inorganic glass molded body disposed at a position where all or a part of the light which is emitted from the LED element passes through, a first bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body, and a second bonding portion provided between the LED element and the inorganic glass molded body. The LED element is shielded from the outside air by the substrate, the inorganic glass molded body and the first bonding portion. A material which forms the second bonding portion contains a condensation polymerization-type silicone resin. A distance between the LED element and the inorganic glass molded body is 0.1 mm or less.
1. An LED device comprising:
a substrate;
an LED element disposed on the substrate;
an inorganic glass molded body disposed at a position where all or a part of light which is emitted from the LED element passes through;
a first bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body; and
a second bonding portion provided between the LED element and the inorganic glass molded body,
wherein the LED element is shielded from outside air by the substrate, the inorganic glass molded body and the first bonding portion;
wherein the second bonding portion comprises a cured product of a condensation polymerization-type silicone resin;
wherein a distance between the first bonding portion and the LED element is 0 mm or more and 0.5 mm or less; and
wherein a distance between the LED element and the inorganic glass molded body is 0.1 mm or less.
2. An LED device comprising:
a substrate;
an LED element disposed on the substrate;
an inorganic glass molded body disposed at a position where all or a part of light which is emitted from the LED element passes through; and
a bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body,
wherein the LED element is shielded from outside air by the substrate, the inorganic glass molded body and the bonding portion;
wherein the bonding portion comprises a cured product of a silicone resin; and
wherein a distance between the LED element and the inorganic glass molded body is 0 mm.
3. The LED device according to claim 1 , wherein the inorganic glass molded body comprises a convex portion covering at least a part of a side surface of the LED element.
4. The LED device according to claim 3 , wherein the convex portion encloses a periphery of the LED element in a closed ring shape in a plan view.
5. The LED device according to claim 1 , wherein the first bonding portion comprises a curable resin.
6. The LED device according to claim 5 , wherein the curable resin is a silicone resin.
7. The LED device according to claim 1 , wherein the inorganic glass molded body is composed of silica glass or borosilicate glass.
8. The LED device according to claim 1 , wherein a peak wavelength of the light which is emitted from the LED element is 400 nm or less.
9. The LED device according to claim 1 , wherein the LED element is flip-chip mounted on the substrate.
10. The LED device according to claim 1 , wherein the first bonding portion internally embeds the LED element and the inorganic glass molded body.
11. The LED device according to claim 1 , further comprising a plurality of the LED elements,
wherein the inorganic glass molded body is disposed at a position where all or a part of light which is emitted from the plurality of LED elements passes through.
12. An LED module comprising a plurality of the LED devices according to claim 1 .
13. An ultraviolet light emitting device comprising the LED device according to claim 1 .
14. The LED device according to claim 1 , wherein the first bonding portion comprises a cured product of a silicone resin.