Electronic device and heat dissipation module thereof
An electronic device includes a chassis, a heat source, a thermal diffusion plate, at least one heat pipe and a partition plate. The thermal diffusion plate is thermally connected to the heat source. The heat pipe includes a first end portion and a second end portion. The first end portion is fixedly connected to the thermal diffusion plate. The partition plate is arranged between the chassis and the heat pipe, and is thermally connected to the chassis and the heat pipe. The heat pipe is completely separated from the chassis.
1. An electronic device, comprising:
a chassis;
a heat source;
a thermal diffusion plate thermally coupled to the heat source;
at least one heat pipe, each of the at least one heat pipe comprising a first end portion and a second end portion, wherein the first end portion is fixedly connected to the thermal diffusion plate; and
a partition plate arranged between the chassis and the at least one heat pipe, and thermally connected to the chassis and the at least one heat pipe, the partition plate comprising a protrusive portion fixedly connected to the chassis; and two supporting portions respectively connected to two opposite sides of the protrusive portion, wherein the at least one heat pipe is completely separated from the chassis, a first air gap is formed between the chassis and each of the two supporting portions, and the two supporting portions collectively support the at least one heat pipe.
2. The electronic device of claim 1 , wherein the thermal diffusion plate is arranged between the heat source and the at least one heat pipe.
3. The electronic device of claim 2 , wherein the first end portion and the second end portion of the at least one heat pipe are both disposed on a surface of the thermal diffusion plate.
4. The electronic device of claim 3 , wherein a second air gap is formed between the chassis and the surface of the thermal diffusion plate, and the first end portion and the second end portion of the at least one heat pipe are both disposed in the second air gap.
5. The electronic device of claim 3 , wherein the number of the at least one heat pipe is two, and the two heat pipes are symmetrically arranged on the surface of the thermal diffusion plate.
6. A heat dissipation module, comprising:
a thermal diffusion plate thermally coupled to a heat source;
at least one heat pipe disposed on the thermal diffusion plate, each of the at least one heat pipe comprising a first end portion and a second end portion which are fixedly connected to a same surface of the thermal diffusion plate; and
a partition plate that is arranged oppositely to the thermal diffusion plate, supports the at least one heat pipe, and is thermally connected to the at least one heat pipe, and the partition plate comprising a protrusive portion and two supporting portions, wherein the two supporting portions are respectively connected to two opposite sides of the protrusive portion, the two supporting portions collectively support the at least one heat pipe, and the protrusive portion projects towards a direction of the partition plate opposite to the at least one heat pipe, wherein a plane level at which the at least one heat pipe is located is higher than a plane level at which the partition plate is located.