Interconnect structure for package-on-package devices
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
1. A semiconductor device comprising:
an integrated circuit die, the integrated circuit die having an active side and a backside, the active side having electrical contacts;
a protective layer over a backside of the integrated circuit die;
a die-attach film interposed between the protective layer and the integrated circuit die;
a molding compound adjacent opposing sidewalls of the integrated circuit die, opposing sidewalls of the die-attach film, and opposing sidewalls of the protective layer; and
conductors extending through the molding compound.
2. The semiconductor device of claim 1 , wherein a surface of the conductors are level with a surface of the protective layer.
3. The semiconductor device of claim 1 , wherein each of the conductors comprises a seed layer and a through via overlying the seed layer.
4. The semiconductor device of claim 3 , further comprising an electrical connection coupled to the seed layer, wherein the seed layer is interposed between the through via and the electrical connection.
5. The semiconductor device of claim 4 , further comprising:
a package bonded to the electrical connection; and
an underfill extending from the protective layer to the package.
6. The semiconductor device of claim 1 , further comprising one or more redistribution layers over the molding compound and the integrated circuit die.
7. The semiconductor device of claim 6 , wherein integrated circuit die is interposed between the one or more redistribution layers and the protective layer.
8. A semiconductor device comprising:
an integrated circuit die;
a molding compound adjacent sidewalls of the integrated circuit die;
a protective layer over the integrated circuit die and the molding compound, the protective layer being in direct contact with the molding compound; and
conductors extending through the molding compound and the protective layer, the conductors comprising a single continuous material in the molding compound and the protective layer, a surface of the conductors being level with a surface of the protective layer.
9. The semiconductor device of claim 8 , further comprising a die-attach film interposed between the integrated circuit die and the protective layer.
10. The semiconductor device of claim 8 , further comprising:
a package; and
first electrical connectors electrically coupling the package to the conductors.
11. The semiconductor device of claim 10 , further comprising one or more redistribution layers along a surface of the integrated circuit die and the molding compound, wherein the conductors and portions of the one or more redistribution layers are electrically interposed between the package and the integrated circuit die.
12. The semiconductor device of claim 11 , further comprising second electrical connectors electrically coupled to the one or more redistribution layers, wherein the one or more redistribution layers are interposed between the second electrical connectors and the integrated circuit die.
13. The semiconductor device of claim 10 , wherein the first electrical connectors comprise solder.
14. The semiconductor device of claim 8 , wherein sidewalls of the protective layer are free of the molding compound.
15. A semiconductor device comprising:
an integrated circuit die, the integrated circuit die having an active side and a backside, the active side having electrical contacts;
a molding compound adjacent sidewalls of the integrated circuit die;
a protective layer over a backside of the integrated circuit die, the protective layer extending along a surface of the molding compound;
through vias extending through the molding compound;
a package electrically coupled to the through vias by electrical connectors; and
underfill interposed between the protective layer and the package.
16. The semiconductor device of claim 15 , wherein the through vias extend through the protective layer.
17. The semiconductor device of claim 15 , wherein the through vias comprise a seed layer and a conductive layer.
18. The semiconductor device of claim 17 , wherein a surface of the seed layer is level with a surface of the molding compound.
19. The semiconductor device of claim 15 , further comprising solder coupled to the through vias.
20. The semiconductor device of claim 19 , wherein the solder extends through the protective layer.