IP Library › Granted Patent US 10,269,844
Granted Patent B2
US 10,269,844 · App. 15/634,148 · Granted Apr 23, 2019

Structure and formation method of light sensing device

Inventors: Yun-Wei Cheng (Taipei, TW); Yi-Hsing Chu (Tainan, TW); Yin-Chieh Huang (Tainan, TW); Chun-Hao Chou (Tainan, TW); Kuo-Cheng Lee (Tainan, TW); Hsun-Ying Huang (Tainan, TW); Hsin-Chi Chen (Tainan, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H01L27/14621H01L27/14623H01L27/14629H01L27/14685
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Quick Facts
Patent No.
US 10,269,844
App. No.
15/634,148
Granted
Apr 23, 2019
Kind
B2
Abstract

Structures and formation methods of a light sensing device are provided. The light sensing device includes a semiconductor substrate and a light sensing region in the semiconductor substrate. The light sensing device also includes a filter element over the semiconductor substrate and aligned with the light sensing region. The filter element has a first portion and a second portion, and the first portion is between the second portion and the light sensing region. The light sensing device further includes a light shielding element over the semiconductor substrate and beside the first portion of the filter element. In addition, the light sensing device includes a dielectric element over the light shielding element and beside the second portion of the filter element. A top width of the light shielding element is greater than a bottom width of the dielectric element.

Claims (37)

1. A light sensing device, comprising:

a semiconductor substrate;

a light sensing region in the semiconductor substrate;

a filter element over the semiconductor substrate and aligned with the light sensing region, wherein the filter element has a first portion and a second portion, and the first portion is between the second portion and the light sensing region;

a light shielding element over the semiconductor substrate and beside the first portion of the filter element; and

a dielectric element over the light shielding element and beside the second portion of the filter element, wherein a top width of the light shielding element is greater than a bottom width of the dielectric element.

2. The light sensing device as claimed in claim 1 , wherein the light shielding element surrounds the first portion of the filter element, and the dielectric element surrounds the second portion of the filter element.

3. The light sensing device as claimed in claim 1 , further comprising a passivation layer surrounding the filter element, wherein the passivation layer is between the light shielding element and the filter element.

4. The light sensing device as claimed in claim 3 , wherein the passivation layer is in direct contact with a top surface of the light shielding element.

5. The light sensing device as claimed in claim 1 , further comprising a second dielectric element over the dielectric element, wherein the second dielectric element surrounds a third portion of the filter element, and the second portion is between the first portion and the third portion of the filter element.

6. The light sensing device as claimed in claim 5 , wherein a top width of the dielectric element is greater than a bottom width of the second dielectric element.

7. The light sensing device as claimed in claim 1 , wherein a bottom width of the light shielding element is greater than the top width of the light shielding element, and the bottom width of the dielectric element is greater than a top width of the dielectric element.

8. The light sensing device as claimed in claim 7 , wherein the light shielding element has a first slanted sidewall surface, and the dielectric element has a second slanted sidewall surface.

9. The light sensing device as claimed in claim 8 , wherein the first slanted sidewall surface is not parallel to the second slanted sidewall surface.

10. The light sensing device as claimed in claim 1 , wherein the filter element has a circle profile or an oval profile.

11. A light sensing device, comprising:

a semiconductor substrate;

a light sensing region in the semiconductor substrate;

a filter element over the semiconductor substrate and aligned with the light sensing region;

a light reflective element over the semiconductor substrate and surrounding a lower portion of the filter element;

a dielectric element over the light reflective element and surrounding an upper portion of the filter element; and

a passivation layer over the dielectric element and between the filter element and the light reflective element.

12. The light sensing device as claimed in claim 11 , wherein a top surface of the light reflective element has an inner portion and an outer portion surrounding the inner portion, and an entirety of a bottom surface of the dielectric element is in direct contact with the inner portion of the top surface of the light reflective element.

13. The light sensing device as claimed in claim 11 , wherein the light reflective element gradually becomes narrower along a direction from a bottom surface of the light reflective element towards the dielectric element.

14. The light sensing device as claimed in claim 13 , wherein the dielectric element gradually becomes wider along a direction from a top surface of the dielectric element towards the light reflective element.

15. The light sensing device as claimed in claim 14 , wherein the passivation layer and the dielectric element together cover a top surface of the light reflective element.

16. The light sensing device as claimed in claim 11 , wherein the passivation layer surrounds the filter element, a lower portion of the passivation layer is between the light reflective element and the filter element, and an upper portion of the passivation layer is between the dielectric element and the filter element.

17. A light sensing device, comprising:

a semiconductor substrate;

a filter element over the semiconductor substrate;

a light sensing region below the filter element;

a light shielding element over the semiconductor substrate and surrounding a lower portion of the filter element;

a dielectric element over the light shielding element and surrounding an upper portion of the filter element; and

a passivation layer surrounding the filter element, wherein a lower portion of the passivation layer is between the light shielding element and the filter element, and an upper portion of the passivation layer is between the dielectric element and the filter element.

18. The light sensing device as claimed in claim 17 , wherein a top surface of the light shielding element has an inner portion and an outer portion surrounding the inner portion, and an entirety of a bottom surface of the dielectric element is in direct contact with the inner portion of the top surface of the light shielding element.

19. The light sensing device as claimed in claim 17 , wherein the passivation layer covers a bottom surface of the filter element.

20. The light sensing device as claimed in claim 17 , wherein the passivation layer is in direct contact with the filter element and the light shielding element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2017
From: CHENG, YUN-WEI; CHU, YI-HSING; HUANG, YIN-CHIEH; CHOU, CHUN-HAO; LEE, KUO-CHENG; HUANG, HSUN-YING; CHEN, HSIN-CHI
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 042832/0740 →
Continuity (1)
Related Publication 20180374884A1 · Dec 27, 2018
Cited By (2)
US 12,677,491 US 12,713,726