IP Library Granted Patent US 10,270,016
Granted Patent B2
US 10,270,016 · App. 16/030,014 · Granted Apr 23, 2019

Light emitting device

Inventor: Hiroki Yuu (Anan, JP)
Assignee: NICHIA CORPORATION
H01L33/52H01L21/82H01L33/005H01L33/44H01L33/62H01L2933/005H01L2933/0025H01L2933/0066
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Quick Facts
Patent No.
US 10,270,016
App. No.
16/030,014
Granted
Apr 23, 2019
Kind
B2
Abstract

A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. The metal layer is connected to the pair of electrodes. The metal layer covers an outer surface of the covering member.

Claims (13)

1. A light emitting device comprising:

a light emitting element including a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface;

a covering member covering a side surface of the light emitting element; and

a metal layer connected to the pair of electrodes, the metal layer covering an outer surface of the covering member.

2. The light emitting device according to claim 1 , wherein

the covering member includes a region having a smaller thickness than a thickness in other regions of the covering member, and

the metal layer covers the covering member in the region having the smaller thickness.

3. The light emitting device according to claim 1 , wherein

a height of the metal layer in a direction along a side surface of the light emitting device is about 15 to 50% of a height of the light emitting device from a lower surface of the light emitting device.

4. The light emitting device according to claim 1 , wherein

the metal layer includes a plurality of laminated layers.

5. The light emitting device according to claim 1 , wherein

a thickness of the metal layer is 1 μm or less.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2018
From: YUU, HIROKI
To: NICHIA CORPORATION
Reel/Frame 046294/0404 →
Priority Claims (2)
JP 2016-191246 · Sep 29, 2016 · national
JP 2017-184703 · Sep 26, 2017 · national
Continuity (2)
Continuation 15717242 · Sep 27, 2017
Related Publication 20180315904A1 · Nov 1, 2018