Antenna module and electronic device
According to one embodiment, an antenna module includes a substrate, a first antenna, an array antenna, and a radio frequency (RF) module. The first antenna includes a first radiation element arranged on the substrate and a first ground plane arranged on the substrate. The array antenna includes a plurality of second radiation elements arranged on the substrate. The substrate includes a first surface and a second surface. The first ground plane is arranged on at least the first surface of the substrate. The plurality of second radiation elements are arranged on the second surface of the substrate and opposed to the first ground plane via the substrate.
1. An antenna module, comprising: a substrate; a first antenna including a first radiation element arranged on the substrate, a ground plane connected to the first radiation element, and a feed point arranged between the first radiation element and the ground plane, the first antenna transmitting and receiving electromagnetic waves of a first frequency band; a second antenna including a plurality of second radiation elements arranged on the substrate, the second antenna transmitting and receiving electromagnetic waves of a second frequency band higher than the first frequency band; and a radio frequency (RF) module connected to the second antenna, the radio frequency (RF) module feeding radio frequency (RF) signals of the second frequency band to the second antenna, the substrate including a first surface and a second surface, the ground plane being arranged on at least the first surface of the substrate, the plurality of second radiation elements being arranged on the second surface of the substrate and opposed to the ground plane, the first antenna being a monopole antenna placed on the first surface, and the second antenna being a millimeter wave antenna, wherein the plurality of second radiation elements and the radio frequency (RF) module are connected to each other by a plurality of vias which penetrate the substrate and the ground plane, and wherein the vias are electrically insulated from the ground plane.
2. The antenna module of claim 1 , wherein
the first radiation element and the ground plane function as an antenna for a cellular communication system,
the ground plane and the plurality of second radiation elements function as a plurality of patch antennas, and
the second frequency band includes a millimeter-wave frequency band.
3. The antenna module of claim 1 , wherein
the ground plane includes a region which is larger than a region in which the first radiation element is arranged, and
the plurality of second radiation elements are arranged on a first area of the second surface of the substrate, the first area of the second surface being opposed to a central region of the ground plane.
4. The antenna module of claim 1 , wherein
at least a part of the ground plane and the radio frequency (RF) module are arranged on the first surface of the substrate, and
the antenna module further comprises a thermally conductive member that connects an upper surface of the radio frequency (RF) module to the ground plane and transfers heat generated from the radio frequency (RF) module to the ground plane.
5. The antenna module of claim 4 , wherein
the thermally conductive member includes a thermally conductive sheet applied onto the upper surface of the radio frequency (RF) module and the ground plane.
6. An electronic device, comprising: a processor that processes data; a transceiver connected to the processor, the transceiver executing wireless communication using a first frequency band and a second frequency band higher than the first frequency band; and an antenna module, wherein the antenna module comprises: a substrate including a first surface and a second surface; a first antenna including a first radiation element arranged on the substrate and a ground plane connected to the first radiation element, and a feed point arranged between the first radiation element and the ground plane, the first antenna transmitting and receiving electromagnetic waves of the first frequency band; a second antenna including a plurality of second radiation elements arranged on the substrate, the second antenna transmitting and receiving electromagnetic waves of the second frequency band; and a radio frequency (RF) module that feeds radio frequency (RF) signals of the second frequency band to the second antenna, the ground plane being arranged on at least the first surface of the substrate, the plurality of second radiation elements being arranged on the second surface of the substrate and opposed to the ground plane, the first antenna being a monopole antenna placed on the first surface, and the second antenna being a millimeter wave antenna, wherein the plurality of second radiation elements and the radio frequency (RF) module are connected to each other by a plurality of vias which penetrate the substrate and the ground plane, and wherein the vias are electrically insulated from the ground plane.
7. The electronic device of claim 6 , wherein
the first radiation element and the ground plane function as an antenna for a cellular communication system,
the ground plane and the plurality of second radiation elements function as a plurality of patch antennas, and
the second frequency band includes a millimeter-wave frequency band.
8. The electronic device of claim 6 , wherein
the ground plane includes a region which is larger than a region in which the first radiation element is arranged, and
the plurality of second radiation elements are arranged on a first area of the second surface of the substrate, the first area of the second surface being opposed to a central region of the ground plane.
9. The electronic device of claim 6 , wherein
at least a part of the ground plane and the radio frequency (RF) module are arranged on the first surface of the substrate, and
the electronic device further comprises a thermally conductive member that connects an upper surface of the radio frequency (RF) module to the ground plane and transfers heat generated from the radio frequency (RF) module to the ground plane.
10. The electronic device of claim 9 , wherein
the thermally conductive member includes a thermally conductive sheet applied onto the upper surface of the radio frequency (RF) module and the ground plane.