IP Library › Granted Patent US 10,271,000
Granted Patent B2
US 10,271,000 · App. 15/175,748 · Granted Apr 23, 2019

Image sensor module and image sensor device including the same

Inventors: Yohwan Noh (Yongin-si, KR); Chaesung Kim (Seoul, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H04N5/378H01L27/14621H01L27/14643H04N5/3456H04N9/045H04N9/04511H01L27/14612
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Quick Facts
Patent No.
US 10,271,000
App. No.
15/175,748
Granted
Apr 23, 2019
Kind
B2
Abstract

Disclosed is an image sensor module which includes a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns, an analog to digital converter connected to the pixel array through a plurality of data lines and converting signals output from the plurality of sub-pixels into digital signals, a row decoder connected to the pixel array through a plurality of selection lines, a plurality of transfer lines, and a plurality of reset lines, and a control logic circuit controlling the analog to digital converter and the row decoder to allow a plurality of sub-frames to be sequentially outputted from the plurality of sub-pixels, wherein each of the plurality of sub-frames is generated based on signals output from different sub-pixels among the plurality of sub-pixels.

Claims (57)

1. An image sensor module comprising:

a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns;

an analog to digital converter connected to the pixel array through a plurality of data lines and converting signals output from the plurality of sub-pixels into digital signals;

a row decoder connected to the pixel array through a plurality of selection lines, a plurality of transfer lines, and a plurality of reset lines; and

a control logic circuit configured to control the analog to digital converter and the row decoder to allow a plurality of sub-frames to be sequentially outputted from the plurality of sub-pixels,

wherein each of the plurality of sub-frames is generated based on signals output from different sub-pixels among the plurality of sub-pixels,

wherein a first sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, placed on a first sub-array, from among the plurality of sub-pixels,

wherein a second sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, placed on a second sub-array different from the first sub-array, from among the plurality of sub-pixels, and

wherein a third sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, places on a third sub-array different from the first and second sub-array, from among the plurality of sub-pixels.

2. The image sensor module of claim 1 ,

wherein a fourth sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, placed on a fourth sub-array different from the first, second, and third sub-arrays, from among the plurality of sub-pixels.

3. The image sensor module of claim 2 , wherein during a sensing operation about sub-pixels on the first sub-array, a sensing operation about sub-pixels on one of the second to fourth sub-arrays commences.

4. The image sensor module of claim 2 , wherein the first sub-array is an arrangement defined by a first row group including at least two rows from among the plurality of rows and a first column group including at least two columns from among the plurality of columns,

wherein the second sub-array is an arrangement defined by the first row group and a second column group including at least two columns from among the plurality of columns,

wherein the third sub-array is an arrangement defined by a second row group including at least two rows from among the plurality of rows and the first column group, and

wherein the fourth sub-array is an arrangement defined by the second row group and the second column group.

5. The image sensor module of claim 4 , wherein the first row group includes odd-numbered rows among the plurality of rows, the second row group includes even-numbered rows among the plurality of rows, the first column group includes odd-numbered rows among the plurality of columns, the second column group includes even-numbered rows among the plurality of columns.

6. The image sensor module of claim 4 , wherein each of the first to fourth sub-arrays is configured to have a Bayer pattern.

7. The image sensor module of claim 1 , wherein a first sub-pixel among the plurality of sub-pixels comprises:

a first color filter configured to pass light having a predetermined color;

a first photodiode configured to generate charges in response to the light passing through the first color filter;

a first transfer transistor configured to be placed between one end of the first photodiode and a first node and operate in response to a signal on a first transfer line among the plurality of transfer lines;

a first reset transistor configured to be placed between a power supply voltage and the first node and operate in response to a first reset line among the plurality of reset lines;

a first selection transistor configured to be placed between the power supply voltage and a second node and operate in response to a voltage on the first node; and

a first access transistor configured to be placed between the second node and a first data line among the plurality of data lines and operate in response to a signal on a first selection line among the plurality of selection lines.

8. The image sensor module of claim 7 , wherein a second sub-pixel, placed at the same row as the first sub-pixel, among the plurality of sub-pixels comprises:

a second color filter configured to pass light having a predetermined color;

a second photodiode configured to generate charges in response to the light passing through the second color filter;

a second transfer transistor configured to be placed between one end of the second photodiode and a third node and operate in response to a signal on a second transfer line among the plurality of transfer lines;

a second reset transistor configured to be placed between the power supply voltage and the third node and operate in response to the first reset line;

a second selection transistor configured to be placed between the power supply voltage and a fourth node and operate in response to a voltage on the third node; and

a second access transistor configured to be placed between the fourth node and a second data line among the plurality of data lines and operate in response to a signal on the first selection line.

9. The image sensor module of claim 1 , wherein the control logic circuit provides a row address to the row decoder such that the plurality of sub-frames is non-sequentially read.

10. The image sensor module of claim 1 , wherein the pixel array comprises a color filter array of a 4PD-Bayer pattern.

11. The image sensor module of claim 1 , wherein the control logic circuit provides a row address to the row decoder such that the plurality of sub-frames is read to be overlapped.

12. An image sensor device comprising:

a first image sensor module generating a first frame in a first read manner; and

a second image sensor module generating a plurality of sub-frames corresponding to the first frame in a second read manner while the first frame of the first image sensor module is generated, wherein the second image sensor module comprises a pixel array including a plurality of sub-pixels,

wherein a first sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, placed on a first sub-array, from among the plurality of sub-pixels,

wherein a second sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, placed on a second sub-array different from the first sub-array, from among the plurality of sub-pixels, and

wherein a third sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, placed on a third sub-array different from the first and second sub-arrays, from among the plurality of sub-pixels.

13. The image sensor device of claim 12 , wherein the first image sensor module comprises a pixel array including a plurality of sub-pixels, and wherein the plurality of sub-pixels of the pixel array is arrayed based on a color filter array of a Bayer pattern.

14. The image sensor device of claim 12 , wherein the plurality of sub-pixels of the pixel array is arrayed based on a color filter array of a 4PD-Bayer pattern.

15. The image sensor device of claim 14 ,

wherein a fourth sub-frame among the plurality of sub-frames is generated based on signals output from sub-pixels, placed on a fourth sub-array different from the first, second, and third sub-arrays, from among the plurality of sub-pixels.

16. The image sensor device of claim 15 , wherein the first sub-array is an arrangement defined by a first row group including at least two rows from among a plurality of rows and a first column group including at least two columns from among a plurality of columns,

wherein the second sub-array is an arrangement defined by the first row group and a second column group including at least two columns from among the plurality of columns,

wherein the third sub-array is an arrangement defined by a second row group including at least two rows from among the plurality of rows and the first column group, and

wherein the fourth sub-array is an arrangement defined by the second row group and the second column group.

17. The image sensor device of claim 12 , wherein the first frame and the plurality of sub-frames are provided to an external image signal processing unit.

18. An image sensor module comprising:

a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns;

an analog to digital converter connected to the pixel array through a plurality of data lines and converting signals output from the plurality of sub-pixels into digital signals;

a row decoder connected to the pixel array through a plurality of selection lines, a plurality of transfer lines, and a plurality of reset lines; and

a control logic circuit configured to control the analog to digital converter and the row decoder to allow a first sub-frame to be outputted from sub-pixels, placed on odd-numbered rows and odd-numbered columns, from among the plurality of sub-pixels, a second sub-frame to be outputted from sub-pixels, placed on the odd-numbered rows and even-numbered columns, from among the plurality of sub-pixels, a third sub-frame to be outputted from sub-pixels, placed on even-numbered rows and the odd-numbered columns, from among the plurality of sub-pixels, and a fourth sub-frame to be outputted from sub-pixels, placed on the even-numbered rows and the even-numbered columns, from among the plurality of sub-pixels.

19. The image sensor module of claim 18 , wherein the control logic circuit is further configured to control the analog to digital converter and the row decoder to allow the first to fourth sub-frames to be sequentially outputted.

20. The image sensor module of claim 18 , wherein sub-pixels placed on the odd-numbered columns from among sub-pixels at a first row are connected to the row decoder through a first transfer line and sub-pixels placed on the even-numbered columns from among sub-pixels at the first row are connected to the row decoder through a second transfer line.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2016
From: NOH, YOHWAN; KIM, CHAESUNG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 038835/0350 →
Priority Claims (1)
KR 10-2015-0104489 · Jul 23, 2015 · national
Continuity (1)
Related Publication 20170026600A1 · Jan 26, 2017