IP Library › Granted Patent US 10,272,490
Granted Patent B2
US 10,272,490 · App. 15/514,879 · Granted Apr 30, 2019

Silver powder, method for producing same, and hydrophilic conductive paste

Inventors: Naoki Tahara (Tokyo, JP); Noriaki Nogami (Tokyo, JP); Hiroshi Kamiga (Tokyo, JP)
Assignee: DOWA Electronics Materials Co., Ltd.
B22F1/0074B22F1/0062B22F9/24C09D5/24C09D7/68C09D11/30C09D11/52C09D101/28H01B1/22B22F2009/245B22F2301/255B22F2302/45B22F2998/10
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Quick Facts
Patent No.
US 10,272,490
App. No.
15/514,879
Granted
Apr 30, 2019
Kind
B2
Abstract

A silver powder, wherein the silver powder satisfies D 50 -IPA>D 50 -W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D 50 -IPA (μm) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D 50 -W (μm) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.

Claims (21)

1. A silver powder,

wherein the silver powder satisfies D 50 -IPA>D 50 -W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D 50 -IPA (μm) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D 50 -W (μm) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and

wherein the silver powder contains a phosphorus-containing compound on a surface of the silver powder, wherein the phosphorus-compound is phytic acid, and

wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.

2. The silver powder according to claim 1 , wherein the cumulative 50% point of particle diameter D 50 of the silver powder is 0.1 μm or more but 5 μm or less and a BET specific surface area of the silver powder is 0.1 m 2 /g or more but 5 m 2 /g or less.

3. A hydrophilic conductive paste, comprising:

the silver powder according to claim 1 .

4. A hydrophilic conductive paste, comprising:

the silver powder according to claim 1 ;

a resin; and

a solvent,

wherein the solvent is water.

5. A silver powder, comprising:

phytic acid on a surface of the silver powder.

6. A hydrophilic conductive paste, comprising:

the silver powder according to claim 5 .

7. A hydrophilic conductive paste, comprising:

the silver powder according to claim 5 ;

a resin; and

a solvent,

wherein the solvent is water.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2017
From: TAHARA, NAOKI; NOGAMI, NORIAKI; KAMIGA, HIROSHI
To: DOWA ELECTRONICS MATERIALS CO., LTD.
Reel/Frame 041763/0814 →
Priority Claims (2)
JP 2014-198979 · Sep 29, 2014 · national
JP 2015-188835 · Sep 25, 2015 · national
Continuity (1)
Related Publication 20170216913A1 · Aug 3, 2017