Semiconductor memory device
A semiconductor memory device includes a plurality of memory chips that are stacked above one another and connected to each other through a through via, an interface chip that is connected to the plurality of memory chips, and a plurality of first terminals for connection with an external device. The interface chip includes a plurality of second terminals that are connected to the plurality of first terminals, and is capable of receiving a signal that is supplied from the external device through the first and second terminals, and stores configuration information according to which a set number of the second terminals are designated for receiving control signals for the plurality of memory chips.
1. A semiconductor memory device comprising:
a plurality of memory chips that are stacked above one another and connected to each other through a through via;
an interface chip that is connected to the plurality of memory chips; and
a plurality of first terminals for connection with an external device,
wherein the interface chip includes a plurality of second terminals that are connected to the plurality of first terminals, and is capable of receiving a signal that is supplied from the external device through the first and second terminals, and stores configuration information according to which a set number of the second terminals are designated for receiving control signals for the plurality of memory chips.
2. The semiconductor memory device according to claim 1 , wherein the set number of the second terminals designated in the configuration information is at least one.
3. The semiconductor memory device according to claim 1 , wherein
the plurality of memory chips is divided into four or more groups, each group having at least two memory chips and a unique chip address that is shared among the memory chips of the group, and the set number of the second terminals designated in the configuration information is at least two.
4. The semiconductor memory device according to claim 1 , wherein each of the first terminals is connected to a different one of the second terminals.
5. The semiconductor memory device according to claim 1 , wherein the second terminals are each allocated to receive a chip enable signal from the external device.
6. The semiconductor memory device according to claim 1 , wherein the interface chip includes a plurality of third terminals that are connected to the plurality of first terminals and are each allocated to output a ready/busy signal to the external device.
7. The semiconductor memory device according to claim 6 , wherein the configuration information also designates a set number of the third terminals that are to be used in outputting the read/busy signal.
8. The semiconductor memory device according to claim 1 , wherein the configuration information is supplied by the external device.
9. The semiconductor memory device according to claim 1 , wherein one of the memory chips stores the configuration information and the configuration information is read from said one of the memory chips.
10. A semiconductor memory device comprising:
a plurality of memory chips that are stacked above one another and connected to each other through a through via; and
an interface chip connected to the plurality of memory chips, the interface chip including first and second input/output circuits and a plurality of terminals through which signals are transmitted between the interface chip and external devices, wherein
the first input/output circuit includes a calibration circuit configured to adjust an on-state resistance and a termination resistance of the first input/output circuit using a calibration resistor connected to the calibration circuit through one of the terminals, and
the interface chip stores configuration information designating one of a first calibration mode in which calibration results from the calibration circuit are applied to both the first and second input/output circuits and a second calibration mode in which the calibration results from the calibration circuit are applied to only to the first input/output circuit and the second input/output circuit is calibrated separately.
11. The semiconductor memory device according to claim 10 , wherein the second input/output circuit includes a calibration circuit configured to adjust an on-state resistance and a termination resistance of the second input/output circuit using another calibration resistor connected to the calibration circuit through another one of the terminals.
12. The semiconductor memory device according to claim 10 , wherein the calibration circuit is a replica circuit of the first input/output circuit and includes a plurality of transistors connected in parallel, and the calibration results indicate different gate voltages that are respectively applied to the transistors of the calibration circuit.
13. The semiconductor memory device according to claim 12 , wherein
each of the first and second input/output circuits includes a plurality of transistors connected in parallel, and
the different gate voltages indicated by the calibration results are respectively applied to the transistors in the first input/output circuit and also respectively applied to the transistors in the second input/output circuit.
14. The semiconductor memory device according to claim 10 , wherein the configuration information is set in response to a command received from an external device.
15. A semiconductor memory device comprising:
a plurality of memory chips that are stacked above one another and connected to each other through a through via, each of the memory chips including a first register; and
an interface chip connected to the plurality of memory chips, and including a second register,
wherein the first register stores parameters relating to reading and writing and does not store parameters relating to an interface of data exchange with an external device, and the second register stores parameters relating to an interface of data exchange with an external device.
16. The semiconductor memory device according to claim 15 , wherein the interface chip includes first and second input/output circuits.
17. The semiconductor memory device according to claim 16 , wherein the parameters stored in the second register include calibration results to be applied to the first and second input/output circuits.
18. The semiconductor memory device according to claim 15 , wherein
the interface chip includes a plurality of terminals through which signals from the external device control the plurality of memory chips, and
the parameters stored in the second register include configuration information according to which a set number of the terminals are designated to receive the signals from the external device.
19. The semiconductor memory device according to claim 18 , wherein the configuration information is supplied by the external device.
20. The semiconductor memory device according to claim 18 , wherein one of the memory chips stores the configuration information and the configuration information is copied from said one of the memory chips.