Microphone device
View Patent ↗A microphone apparatus is disclosed. A microphone apparatus according to an exemplary embodiment includes a vibration membrane disposed inside a case and formed on an upper surface of a main substrate; an acoustic component including an absorbing unit cut over a predetermined section toward the outside of a fixed membrane and having a predetermined pattern; a microphone module including a semiconductor chip electrically connected to the acoustic component inside the case; and a printed circuit board on which the microphone module is mounted.
1. A microphone apparatus comprising:
a microphone module disposed inside a case and having an acoustic component and a semiconductor chip electrically connected to the acoustic component inside the case, wherein the acoustic component has an absorbing unit; and
a printed circuit board on which the microphone module is mounted,
wherein the absorbing unit is cut over a predetermined section toward the outside of a fixed membrane and a vibration membrane, has a predetermined pattern, and comprises a plurality of slits along a circumference of the vibration membrane and the fixed membrane,
wherein the fixed membrane and the vibration membrane are provided in an upper portion of a main substrate, and
wherein the main substrate included in the acoustic component has a bonding step cut over a predetermined section along an edge of a lower surface of the main substrate while an acoustic hole is provided corresponding to a penetration hole on a lower case included in the case.
2. The microphone apparatus of claim 1 , wherein the case comprises:
the lower case in which the acoustic component and the semiconductor chip are electrically connected with each other; and
an upper case providing a receiving space accommodating the acoustic component and the semiconductor chip in an upper portion of the lower case.
3. The microphone apparatus of claim 2 , wherein the acoustic component comprises:
the vibration membrane provided in an upper portion of the main substrate corresponding to the acoustic hole; and
the fixed membrane separately disposed from an upper portion of the vibration membrane.
4. The microphone apparatus of claim 3 , wherein the absorbing unit comprises a space with the predetermined pattern encapsulating the vibration membrane to prevent the vibration membrane from being deformed according to deformation of the main substrate at a high temperature when the microphone module is mounted on the printed circuit board.
5. The microphone apparatus of claim 4 , wherein the predetermined pattern of the absorbing unit comprises:
a straight-line unit provided by a plurality of straight-line slits penetrating a main substrate and outwardly disposed, the plurality of straight-line slits being separated in four directions of the vibration membrane and the fixed membrane to encapsulate the vibration membrane and the fixed membrane; and
a connecting unit connecting both ends of the plurality of straight-line slits selectively between the neighboring straight-line units.
6. The microphone apparatus of claim 4 , wherein the predetermined pattern of the absorbing unit comprises:
a straight-line unit formed by one penetrating straight-line slit separated in four directions from the vibration membrane and the fixed membrane to encapsulate the vibration membrane and the fixed membrane, both ends of the straight-line slit extending outwards; and
a connecting unit separate from the neighboring straight-line units along a shape of each end of the straight-line slit.
7. The microphone apparatus of claim 4 , wherein the acoustic component is bonded to the lower case by an adhesive applied to the bonding step.
8. The microphone apparatus of claim 2 , wherein the predetermined pattern of the absorbing unit comprises:
a straight-line unit provided by a plurality of straight-line slits penetrating a main substrate and outwardly disposed, the plurality of straight-line slits being separated in four directions of the vibration membrane and the fixed membrane to encapsulate the vibration membrane and the fixed membrane; and
a connecting unit connecting both ends of the plurality of straight-line slits selectively between the neighboring straight-line units.
9. The microphone apparatus of claim 2 , wherein the predetermined pattern of the absorbing unit comprises:
a straight-line unit formed by one penetrating straight-line slit separated in four directions from the vibration membrane and the fixed membrane to encapsulate the vibration membrane and the fixed membrane, both ends of the straight-line slit extending outwards; and
a connecting unit separate from the neighboring straight-line units along a shape of each end of the straight-line slit.
10. The microphone apparatus of claim 1 , wherein the acoustic component is bonded to the case by an adhesive applied to the bonding step.
11. The microphone apparatus of claim 1 , wherein the absorbing unit has a space with a predetermined pattern encapsulating the vibration membrane,
wherein the vibration membrane is provided in an upper portion of the main substrate, and
wherein the absorbing unit is configured to prevent the vibration membrane from being deformed according to deformation of the main substrate at a high temperature when the microphone module is mounted on the printed circuit board.
12. The microphone apparatus of claim 1 , wherein the predetermined pattern of the absorbing unit comprises:
a straight-line unit provided by a plurality of straight-line slits penetrating the main substrate and outwardly disposed, the plurality of straight-line slits being separated in four directions of the vibration membrane and the fixed membrane to encapsulate the vibration membrane and the fixed membrane; and
a connecting unit connecting both ends of the plurality of straight-line slits selectively between the neighboring straight-line units.
13. The microphone apparatus of claim 1 , wherein the predetermined pattern of the absorbing unit comprises:
a straight-line unit formed by one penetrating straight-line slit separated in four directions from the vibration membrane and the fixed membrane to encapsulate the vibration membrane and the fixed membrane, both ends of the straight-line slit extending outwards; and
a connecting unit separate from the neighboring straight-line units along a shape of each end of the straight-line slit.
14. The microphone apparatus of claim 3 , wherein the acoustic component is bonded to the lower case by an adhesive applied to the bonding step.
15. The microphone apparatus of claim 2 , wherein the printed circuit board comprises an inflow hole connected with a penetration hole of the lower case.