IP Library Granted Patent US 10,281,249
Granted Patent B2
US 10,281,249 · App. 15/562,827 · Granted May 7, 2019

Protection circuit in blasting systems

Inventors: Luis Diego Montaño Rueda (Galdácano-Vizcaya, ES); Jose Maria Ayensa Muro (Galdácano-Vizcaya, ES)
Assignee: MaxamCorp Holding, S.L.
F42B3/182F42B3/122F42B3/16F42C11/06F42D1/055
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Quick Facts
Patent No.
US 10,281,249
App. No.
15/562,827
Granted
May 7, 2019
Kind
B2
Abstract

There is provided an electronic detonator with electronic delayer, comprising: —a conductive shell comprising —an open end for receiving elements such as an explosive charge, and —a closed end, and —a printed circuit board (PCB) comprising the electronic circuit of the delayer, the printed circuit board being placed inside the conductive shell, characterized in that the electronic detonator further comprises at least a resilient, compressible and conductive gasket —positioned by the open end in a space defined by the PCB and an inner surface of the conductive shell, —filling at least part of the space between the PCB and the inner surface of the conductive shell, such that protection against electromagnetic interferences (EMI) is allowed and —contacting the ground connection of the PCB and the inner surface of the conductive shell such that acts as connection path for grounding the PCB, allowing protection against electro-static interference (ESD).

Claims (23)

1. An electronic detonator with electronic delayer, comprising:

a conductive shell comprising:

an open end or inlet for receiving elements such as an explosive charge, and

a closed end, and

a printed circuit board (PCB) comprising the electronic circuit of the delayer, the PCB being placed inside the conductive shell,

wherein the electronic detonator further comprises at least a resilient, compressible and conductive gasket in a position such that the gasket is:

positioned by the open end in a space defined by the PCB and an inner surface of the conductive shell,

filling at least part of the space between the PCB and the inner surface of the conductive shell, such that protection against electromagnetic interferences (EMI) is allowed and

contacting a ground connection of the PCB and the inner surface of the conductive shell such that it acts as a connection path for grounding the PCB, allowing protection against electro-static interference (ESD).

2. The electronic detonator with electronic delayer according to claim 1 wherein the conductive shell is made of metal, preferably copper or aluminium.

3. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is adapted to cover a complete opening between the PCB and the conductive shell.

4. The electronic detonator with electronic delayer according to claim 1 comprising two conductive gaskets.

5. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is positioned on a shield connection point of the PCB.

6. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is made of a low resistance material.

7. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is positioned on a plane coinciding with a plane of an edge of the open end of the conductive shell.

8. The electronic detonator with electronic delayer according to claim 1 wherein the gasket comprises an inner hole by which the gasket is connected to a shield of the PCB, preferably by means of melted tin.

9. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is semi-circle shaped.

10. The method for manufacturing the electronic detonator according to claim 9 wherein the gasket is positioned on a shield connection point of the PCB.

11. A blasting system comprising an electronic detonator with electronic delayer according to claim 1 .

12. A method for manufacturing the electronic detonator according to claim 1 comprising assembling the at least one resilient, compressible and conductive gasket in the position such that the gasket is:

positioned by the open end in the space defined by the PCB and the inner surface of the conductive shell,

filling at least part of the space between the PCB and the inner surface of the conductive shell, such that protection against electromagnetic interferences (EMI) is allowed and

contacting the ground connection of the PCB and the inner surface of the conductive shell such that it acts as the connection path for grounding the PCB, allowing protection against electro-static interference (ESD).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2017
From: MONTAÑO RUEDA, LUIS DIEGO; AYENSA MURO, JOSE MARÍA
To: MAXAMCORP HOLDING, S.L.
Reel/Frame 044409/0131 →
Priority Claims (1)
EP 15382158 · Mar 30, 2015 · regional
Continuity (1)
Related Publication 20180106578A1 · Apr 19, 2018
Cited By (2)
US 12,203,350 US 12,287,182