Integrated clip and lead and method of making a circuit

Inventors: Makoto Shibuya (Beppu, JP); Makoto Yoshino (Beppu, JP)

Assignee: TEXAS INSTRUMENTS INCORPORATED

H01L21/78 H01L21/561 H01L21/565 H01L23/492 H01L23/49524 H01L23/49537 H01L23/49551 H01L23/49575 H01L23/49861 H01L24/37 H01L24/40 H01L23/4952 H01L2224/37147 H01L2224/40245 H01L2224/84801 H01L2924/00014 H01L2924/181

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Quick Facts

Patent No.: US 10,283,409
App. No.: 15/585,519
Granted: May 7, 2019
Kind: B2

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Abstract

A circuit includes a conductive clip coupled to at least one component in the circuit. At least one lead portion is located on an end of the clip. The circuit further includes a first lead frame having at least one opening sized to receive the at least one lead portion. The at least one lead portion is received in the at least one opening and the at least one lead portion is an external conductor of the circuit.

Claims (13)

1. A method of fabricating a circuit, the method comprising:

placing at least one electronic component between a portion of a first lead frame and a portion of a second lead frame, the first lead frame having a lead portion, the lead portion residing on a different plane than the first lead frame because of a transition, the second lead frame having at least one conductive clip on a same plane as the second lead frame;

attaching the lead portion of the first lead frame to the at least one conductive clip of the second lead frame by swaging;

singulating individual components from the first lead frame and the second lead frame, wherein the lead portion is a lead of the electronic component subsequent to singulating.

2. The method of claim 1 , wherein the singulating breaks any electrical contact between the at least one conductive clip and the first lead frame.

3. The method of claim 1 , further comprising encasing at least the lead portion in a mold compound prior to singulation.

4. The method of claim 3 , wherein at least a portion of the lead portion is exposed from the mold compound after singulation.

5. The method of claim 1 , wherein the swaging includes crushing the lead portion of the first lead frame into the at least one conductive clip of the second lead frame to secure the lead portion of the first lead frame.

6. The method of claim 5 , wherein the lead portion of the first lead frame does not move when the pressures associated with molding are applied to the first lead frame and the second lead frame.

7. The method of claim 1 , wherein the swaging includes deforming the lead portion of the first lead frame into the at least one conductive clip of the second lead frame to secure the lead portion of the first lead frame.

8. The method of claim 7 , wherein the lead portion of the first lead frame does not move when the pressures associated with molding are applied to the first lead frame and the second lead frame.

9. The method of claim 1 , wherein the singulating breaks any electrical contact between the first lead frame and the second lead frame.

10. The method of claim 1 , wherein the electronic component is a dual field effect transistor (dual FET) circuit.

Continuity (2)

Division 14709074 · May 11, 2015

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