IP Library Granted Patent US 10,283,435
Granted Patent B2
US 10,283,435 · App. 15/701,735 · Granted May 7, 2019

Heat dissipation component and terminal device including heat dissipation component

Inventors: Kouichi Shinotou (Yokohama, JP); Tadanori Tachikawa (Hachioji, JP); Masashi Yamashita (Kawasaki, JP)
Assignee: Fujitsu Client Computing Limited
H01L23/427H01L23/4006H01L2023/405H01L2023/4031H01L2023/4056H01L2023/4062H01L2023/4068H01L2023/4087
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Quick Facts
Patent No.
US 10,283,435
App. No.
15/701,735
Granted
May 7, 2019
Kind
B2
Abstract

A heat dissipation component includes a plate that presses a heat receiving portion against a heat generating portion, and a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion, wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate, an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.

Claims (30)

1. A heat dissipation component comprising:

a plate that presses a heat receiving portion against a heat generating portion; and

a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion,

wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate,

an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and

the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.

2. The heat dissipation component according to claim 1 , wherein the heat pipe is in contact with a first surface of the heat receiving portion,

the heat receiving portion has a recess formed on the first surface of the heat receiving portion,

the plate has a through hole formed therethrough and a fixing portion that presses the heat receiving portion against the heat generating portion,

the heat receiving portion is disposed within the through hole,

a height of the first surface of the heat receiving portion and a height of a first surface of the fixing portion are substantially equal to each other, and

a second surface opposite to the first surface of the fixing portion is in contact with a bottom surface of the recess.

3. The heat dissipation component according to claim 1 , wherein the heat pipe is in contact with a first surface of the heat receiving portion,

the heat receiving portion includes a first cylindrical portion and a second cylindrical portion which are rotatable in a plane direction of the plate,

the plate has a through hole formed therethrough,

the first cylindrical portion is disposed within the through hole,

a diameter of the second cylindrical portion is larger than a diameter of the through hole,

the second cylindrical portion is in contact with a second surface opposite to the first surface of the plate, and

a height of the first surface of the plate and a height of the first surface of the heat receiving portion are substantially equal to each other.

4. The heat dissipation component according to claim 1 , wherein the heat receiving portion and the plate are integrally formed of a same material.

5. A terminal device comprising:

a substrate;

a heat generating component on the substrate; and

a heat dissipation component installed on the substrate to be in contact with the heat generating component,

wherein the heat dissipation component includes:

a plate that presses a heat receiving portion against the heat generating component; and

a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion,

wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate,

an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and

the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2019
From: FUJITSU LIMITED
To: FUJITSU CLIENT COMPUTING LIMITED
Reel/Frame 048485/0345 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2017
From: SHINOTOU, KOUICHI; TACHIKAWA, TADANORI; YAMASHITA, MASASHI
To: FUJITSU LIMITED
Reel/Frame 043824/0012 →
Priority Claims (1)
JP 2016-191208 · Sep 29, 2016 · national
Continuity (1)
Related Publication 20180090416A1 · Mar 29, 2018