Image sensor and method for fabricating the same

1. An image sensor comprising:

a substrate comprising a light-receiving region and a pad region disposed around the light-receiving region, wherein the light-receiving region receives light to generate image data;

a photoelectric conversion layer disposed in the light-receiving region of the substrate;

an anti-reflection layer disposed on the photoelectric conversion layer and comprising a plurality of subsidiary anti-reflection layers;

a microlens disposed on the anti-reflection layer;

a delamination-preventing layer disposed in the pad region of the substrate; and

a wiring layer disposed on the delamination-preventing layer,

wherein a lowermost one of the subsidiary anti-reflection layers of the anti-reflection layer includes a first material composition and the delamination-preventing layer includes a second material composition different from the first material composition;

wherein the pad region comprises a recess, and

wherein the wiring layer is disposed directly on the delamination-preventing layer in the recess.

2. The image sensor according to claim 1 , wherein an uppermost one of the subsidiary anti-reflection layers of the anti-reflection layer is substantially the same layer as the delamination-preventing layer.

3. The image sensor according to claim 1 , wherein an uppermost one of the subsidiary anti-reflection layers of the anti-reflection layer includes a third material composition different from the second material composition of the delamination-preventing layer.

4. The image sensor according to claim 1 , wherein a lower surface of the anti-reflection layer and a lower surface of the delamination-preventing layer are disposed in a substantially same plane.

5. The image sensor according to claim 1 , further comprising:

a color filter layer interposed between the anti-reflection layer and the microlens.

6. The image sensor according to claim 1 , further comprising:

a conductive pad disposed on the wiring layer.

7. The image sensor according to claim 1 , further comprising:

a plug, wherein the plug penetrates through the substrate and the delamination-preventing layer of the pad region to be connected to the wiring layer.

8. An image sensor comprising:

a substrate comprising a light-receiving region and a pad region disposed around the light-receiving region, wherein the light-receiving region receives light to generate image data, and the pad region comprises a recess;

a photoelectric conversion layer disposed on the light-receiving region of the substrate;

an anti-reflection layer disposed on the photoelectric conversion layer;

a microlens disposed on the anti-reflection layer;

a delamination-preventing layer disposed on the substrate of the pad region;

a wiring layer disposed on the delamination-preventing layer in the recess; and a conductive pad disposed on the wiring layer and buried in the recess, wherein the anti-reflection layer includes a material composition not included in the delamination-preventing layer;

wherein the anti-reflection layer comprises a plurality of subsidiary anti-reflection layers, and

wherein a lowermost one of the subsidiary anti-reflection layers and the delamination-preventing layer comprise different material compositions.

9. The image sensor according to claim 8 , wherein the anti-reflection layer comprises a plurality of subsidiary anti-reflection layers, and

wherein a material composition of an uppermost one of the subsidiary anti-reflection layers is identical to a material composition of the delamination-preventing layer.

10. The image sensor according to claim 8 , wherein the anti-reflection layer comprises a plurality of subsidiary anti-reflection layers, and

wherein an uppermost one of the subsidiary anti-reflection layers and the delamination-preventing layer comprise different material compositions.

11. The image sensor according to claim 8 , wherein the delamination-preventing layer is disposed conformally on the recess.

12. The image sensor according to claim 8 , wherein a lower surface of the anti-reflection layer is positioned higher in a first direction than a position of a lower surface of the delamination-preventing layer on the recess in the first direction.

13. The image sensor according to claim 8 , further comprising:

a color filter layer interposed between the anti-reflection layer and the microlens.

14. An image sensor comprising:

a photoelectric conversion layer disposed on a light-receiving region of a substrate, wherein the light-receiving region receives light to generate image data;

an anti-reflection layer disposed on the photoelectric conversion layer;

a microlens disposed on the anti-reflection layer;

a delamination-preventing layer disposed on a pad region of the substrate;

a wiring layer disposed on the delamination-preventing layer; and

a conductive pad disposed on the wiring layer,

wherein the anti-reflection layer includes material composition for preventing reflection of incident light and the delamination-preventing layer includes material composition for preventing delamination of the wiring layer;

wherein the pad region comprises a recess, and

wherein the wiring layer is disposed directly on the delamination-preventing layer in the recess.

15. The image sensor according to claim 14 , wherein the anti-reflection layer comprises a first subsidiary anti-reflection layer disposed on the photoelectric conversion layer, and

a second subsidiary anti-reflection layer disposed on the first subsidiary anti-reflection layer.

16. The image sensor according to claim 15 , wherein the first subsidiary anti-reflection layer and the delamination-preventing layer comprise different material compositions.

17. The image sensor according to claim 15 , wherein the second subsidiary anti-reflection layer and the delamination-preventing layer comprise the same material composition.

18. The image sensor according to claim 15 , wherein the first subsidiary anti-reflection layer and the second subsidiary anti-reflection layer are disposed on the pad region of the substrate.