Selective shielding of radio frequency modules
Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency shielding structure extending above the package substrate, a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, and an antenna on the package substrate external to the radio frequency shielding structure. The shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.
1. A packaged radio frequency module comprising:
a package substrate;
a radio frequency shielding structure extending above the package substrate, the radio frequency shielding structure including a shielding layer substantially parallel to the package substrate;
a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, the radio frequency component being disposed between the shielding layer and the package substrate;
a protective layer over the shielding layer, the shielding layer being disposed between the protective layer and the radio frequency component; and
an antenna on the package substrate external to the radio frequency shielding structure, the radio frequency shielding structure configured to provide shielding between the antenna and the radio frequency component.
2. The packaged radio frequency module of claim 1 wherein the radio frequency shielding structure includes wire bonds disposed between the antenna and the radio frequency component.
3. The packaged radio frequency module of claim 1 wherein the radio frequency shielding structure includes wire bond walls disposed around at least two sides of the radio frequency component.
4. The packaged radio frequency module of claim 1 wherein the shielding layer includes copper.
5. The packaged radio frequency module of claim 1 wherein the protective layer includes titanium.
6. The packaged radio frequency module of claim 1 wherein the radio frequency component includes a front end integrated circuit.
7. The packaged radio frequency module of claim 6 wherein the radio frequency component further includes a crystal.
8. The packaged radio frequency module of claim 6 wherein the front end integrated circuit includes a semiconductor-on-insulator die that includes at least one of a low noise amplifier or a power amplifier.
9. The packaged radio frequency module of claim 1 wherein the radio frequency component is attached to the package substrate and the antenna is printed on the package substrate.
10. A packaged radio frequency module comprising:
a package substrate;
a radio frequency shielding structure extending above the package substrate, the radio frequency shielding structure including a wire bond wall disposed around a first side of the radio frequency component and a conformal structure disposed around a second side of the radio frequency component, the second side opposing the first side;
a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure; and
an antenna on the package substrate external to the radio frequency shielding structure, the radio frequency shielding structure configured to provide shielding between the antenna and the radio frequency component, and the wire bond wall extending farther above the package substrate than the antenna.
11. The packaged radio frequency module of claim 10 wherein the radio frequency shielding structure includes a shielding layer substantially parallel to the package substrate, and the radio frequency component is disposed between the shielding layer and the package substrate.
12. The packaged radio frequency module of claim 11 further comprising a protective layer over the shielding layer, the shielding layer being disposed between the protective layer and the radio frequency component.
13. A packaged radio frequency module comprising:
a package substrate;
a radio frequency shielding structure extending above the package substrate;
a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure; and
an antenna on the package substrate external to the radio frequency shielding structure, the radio frequency shielding structure configured to provide shielding between the antenna and the radio frequency component, and the radio frequency component including a low noise amplifier and a switch configured to selectively electrically connect the low noise amplifier to the antenna.
14. The packaged radio frequency module of claim 13 wherein the radio frequency shielding structure includes a shielding layer providing a shield over the radio frequency component and leaving the packaged radio frequency module unshielded over the antenna.
15. The packaged radio frequency module of claim 14 wherein the radio frequency shielding structure includes wire bonds in contact with the shielding layer.
16. A system board assembly comprising:
a packaged component including a radio frequency component on a package substrate, a radio frequency shielding structure around the radio frequency component, and an antenna on the package substrate and outside of the radio frequency shielding structure;
a system board on which the packaged component is disposed, the system board including ground pads electrically connected to the radio frequency shielding structure of the packaged component; and
an electronic component on the system board, the shielding structure providing radio frequency isolation between the radio frequency component and the electronic component.
17. The system board assembly of claim 16 wherein the radio frequency shielding structure includes wire bonds disposed between the antenna and the radio frequency component.
18. A front end module comprising:
a radio frequency component on a package substrate, the radio frequency component including a low noise amplifier and a switch;
an radio frequency shielding structure disposed around the radio frequency component; and
an antenna on the package substrate, the antenna being external to the radio frequency shielding structure, and the switch being configured selectively electrically connect the low noise amplifier with the antenna.
19. The front end module of claim 18 further comprising a bypass path, the switch configured to electrically connect the low noise amplifier and the antenna in a first state and to electrically connect the bypass path and the antenna in a second state.
20. The front end module of claim 19 further comprising a power amplifier, the switch configured to electrically connect the power amplifier and the antenna in a third state.
21. The front end module of claim 20 wherein the low noise amplifier and the power amplifier circuit are embodied on a single semiconductor-on-insulator die.