Chip resistor and mounting structure thereof

1. A resistor comprising:

an insulating substrate including a first surface and a second surface, the first surface of the insulating substrate being spaced apart from the second surface of the insulating substrate in a thickness direction of the insulating substrate;

a bonding layer including a first surface and a second surface, the first surface of the bonding layer being spaced apart from the second surface of the bonding layer in the thickness direction of the insulating substrate, the first surface of the bonding layer facing the insulating substrate side, the first surface of the bonding layer being held in contact with at least a part of the second surface of the insulating layer;

a resistive element including a first surface and a second surface, the first surface of the resistive element being spaced apart from the second surface of the resistive element, the first surface of the resistive element being held in contact with the second surface of the bonding layer;

a first electrode electrically connected to the resistive element; and

a second electrode electrically connected to the resistive element, the second electrode and the first electrode being spaced apart from each other in a first direction perpendicular to the thickness direction of the insulating substrate,

wherein the resistive element includes a first end portion, a second end portion, and a connecting portion, the first end portion being held in contact with the first electrode, the second end portion being held in contact with the second electrode, the connecting portion being continuously connected to the first end portion and the second end portion,

the resistor further comprises an insulating layer that is held in contact with a surface of the connecting portion that is different from the first surface of the resistive element,

wherein the first end portion of the resistive element includes a side surface that faces an opposite side of the second end portion of the resistive element, and

the insulating layer is held in contact with the side surface of the first end portion of the resistive element.

2. The resistor of claim 1 , wherein the second surface of the resistive element includes a section that is located at the first end portion of the resistive element, and

the section of the second surface of the resistive element is held in contact with the insulating layer.

3. The resistor of claim 1 , wherein the first electrode includes a first underlying layer that is held in contact with the insulating layer.

4. The resistor of claim 3 , wherein the first electrode includes a first plated layer,

the first underlying layer includes a side surface, and the first plated layer includes a side surface, and

the side surfaces of the first underlying layer and the first plated layer are flush with each other.

5. The resistor of claim 1 , wherein the connecting portion of the resistive element is continuously connected to the first end portion of the resistive element at a first location,

the connecting portion of the resistive element is continuously connected to the second end portion of the resistive element at a second location, and

the first location is spaced apart from the second location as viewed in the first direction.

6. The resistor of claim 1 , wherein each of the first and second end portions of the resistive element is larger in dimension in a direction perpendicular to the thickness direction and the first direction than the connecting portion of the resistive element.

7. The resistor of claim 1 , wherein each of the first and second end portions of the resistive element includes a same dimension in a direction perpendicular to the thickness direction as the insulating substrate.

8. The resistor of claim 3 , wherein a part of the insulating layer is disposed between the first end portion of the resistive element and the first underlying layer of the first electrode.