IP Library › Granted Patent US 10,291,108
Granted Patent B2
US 10,291,108 · App. 14/849,655 · Granted May 14, 2019

Rectifying devices and rectifier arrangements

Inventors: Dirk Ahlers (Munich, DE); Frank Auer (Roehrmoos, DE); Herbert Gietler (Villach, AT); Michael Lenz (Zorneding, DE)
Assignee: Infineon Technologies AG
H02M1/08H01L27/0207H01L27/0733H02K11/046H02M7/217H02M7/219H02M2001/0048H02M2007/2195Y02B70/1408
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Quick Facts
Patent No.
US 10,291,108
App. No.
14/849,655
Granted
May 14, 2019
Kind
B2
Abstract

A rectifying device includes a power transistor, a gate control circuit and a capacitor structure arranged on a single semiconductor die. The power transistor includes a source or emitter terminal connected to a first terminal of the rectifying device, a drain or collector terminal connected to a second terminal of the rectifying device, and a gate. The gate control circuit is operable to control a gate voltage at the gate of the power transistor based on at least one parameter relating to at least one of a voltage and a current between the first terminal and the second terminal.

Claims (37)

1. A rectifying device, comprising:

a power transistor having a source terminal connected to one of a first terminal and a second terminal of the rectifying device, a drain terminal connected to the other one of the first terminal and the second terminal of the rectifying device and a gate;

a gate control circuit operable to control a gate voltage at the gate of the power transistor based on at least one parameter relating to at least one of a voltage and a current between the first terminal and the second terminal; and

a capacitor structure,

wherein the power transistor, the gate control circuit and the capacitor structure are arranged in a single semiconductor die.

2. The rectifying device of claim 1 , wherein the power transistor is a MOSFET.

3. The rectifying device of claim 1 , wherein the power transistor is a vertical transistor, wherein the source terminal is arranged at a first side of the semiconductor die and the drain terminal is arranged at a second side of the semiconductor die.

4. The rectifying device of claim 1 , wherein the power transistor comprises at least one gate trench comprising an insulation and a gate electrode.

5. The rectifying device of claim 1 , wherein the capacitor structure comprises at least one capacitor trench in the semiconductor die.

6. The rectifying device of claim 5 , wherein the at least one capacitor trench extends vertically from a front side of the semiconductor die into a substrate region of the semiconductor die.

7. The rectifying device of claim 1 , wherein the capacitor structure has a capacity of 10 nF to 500 nF.

8. The rectifying device of claim 1 , wherein the gate control circuit comprises one or more p-type MOS transistors and one or more n-type MOS transistors.

9. The rectifying device of claim 1 , wherein the gate control circuit is connected to the first terminal and to the second terminal and has no additional external connections.

10. The rectifying device of claim 1 , wherein the gate control circuit is configured turn the power transistor on using a voltage that is stored across the capacitor structure during a blocking state of the rectifying device.

11. A press-fit rectifying device, comprising:

a semiconductor die; and

a two-terminal press-fit package comprising a first terminal and a second terminal, wherein the semiconductor die comprises:

a power transistor having a source terminal connected one of the first terminal and the second terminal, a drain terminal connected to the other one of the first terminal and the second terminal and a gate; and

a gate control circuit operable to control a gate voltage at the gate of the power transistor based on at least one parameter relating to at least one of a voltage and a current between the first terminal and the second terminal.

12. The press-fit rectifying device of claim 11 , wherein the semiconductor die further comprises a capacitor structure, and wherein the semiconductor die is arranged as a single semiconductor die in the press-fit package.

13. The press-fit rectifying device of claim 11 , wherein the press-fit package comprises a cup and a nailhead, and wherein the semiconductor die is arranged between the cup and the nailhead with the source terminal facing the cup.

14. The press-fit rectifying device of claim 11 , wherein the press-fit package comprises a cup and a nailhead, and wherein the semiconductor die is arranged between the cup and the nailhead with the drain terminal facing the cup.

15. An electric generator for a motor vehicle, the electric generator comprising at least one rectifying device, the at least one rectifying device comprising:

a power transistor having a source terminal connected to one of a first terminal and a second terminal of the at least one rectifying device, a drain terminal connected to the other one of the first terminal and the second terminal of the at least one rectifying device and a gate;

a gate control circuit operable to control a gate voltage at the gate of the power transistor based on at least one parameter relating to at least one of a voltage and a current between the first terminal and the second terminal; and

a capacitor structure,

wherein the power transistor, the gate control circuit and the capacitor structure are arranged in a single semiconductor die.

16. The electric generator of claim 15 , wherein the at least one rectifying device is configured to electrically connect the source terminal to a stator of the electric generator in a first position and to electrically connect the drain terminal to the stator in a second position.

17. The electric generator of claim 15 , wherein the at least one rectifying device comprises at least one first rectifying device arranged with the source terminal connected to a stator of the electric generator and at least one second rectifying device arranged with the drain terminal facing connected to the stator.

18. An electric generator for a motor vehicle, the electric generator comprising at least one press-fit rectifying device, the at least one rectifying device comprising:

a semiconductor die; and

a two-terminal press-fit package comprising a first terminal and a second terminal,

wherein the semiconductor die comprises:

a power transistor having a source terminal connected one of the first terminal and the second terminal of the at least one rectifying device, a drain terminal connected to the other one of the first terminal and the second terminal of the at least one rectifying device and a gate; and

a gate control circuit operable to control a gate voltage at the gate of the power transistor based on at least one parameter relating to at least one of a voltage and a current between the first terminal and the second terminal.

19. The electric generator of claim 18 , wherein the at least one rectifying device is configured to electcially connect the source terminal to a stator of the electric generator in a first position and to electrcially connect the drain terminal to the stator in a second position.

20. The electric generator of claim 18 , wherein the at least one rectifying device comprises at least one first rectifying device arranged with the source terminal connected to a stator of the electric generator and at least one second rectifying device arranged with the drain terminal facing connected to the stator.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2015
From: AHLERS, DIRK; AUER, FRANK; LENZ, MICHAEL; GIETLER, HERBERT
To: INFINEON TECHNOLOGIES AG
Reel/Frame 037135/0413 →
Priority Claims (1)
DE 10 2014 113 035 · Sep 10, 2014 · national
Continuity (1)
Related Publication 20160072376A1 · Mar 10, 2016
Cited By (1)
US 12,439,621