Light emitting package having phosphor layer over a transparent resin layer
The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body ( 110 ) including a frame ( 111, 112 ) and a body ( 113 ); a light emitting device ( 120 ) including first and second bonding parts ( 121, 122 ) and disposed on the body ( 113 ); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
1. A light emitting device package comprising:
a first frame including a first through-hole;
a second frame spaced apart from the first frame and including a second through-hole;
a body supporting the first and second frames and including a cavity;
a light emitting device disposed in the cavity;
an adhesion layer disposed between the body and the light emitting device;
a reflection layer disposed on a side surface of the cavity;
a transparent layer disposed on the reflection layer and surrounding the light emitting device; and
a phosphor layer disposed on the transparent layer,
wherein the first and second through-holes overlap the light emitting device,
the body includes a recess between the first and second through-holes, and
the adhesion layer is disposed in the recess.
2. The light emitting device package of claim 1 , wherein the transparent layer comprises a transparent resin layer.
3. A lighting apparatus comprising a light emitting unit including the light emitting device package claimed in claim 2 .
4. The light emitting device package of claim 1 , wherein the reflection layer comprises a reflective resin layer.
5. A lighting apparatus comprising a light emitting unit including the light emitting device package claimed in claim 4 .
6. A lighting apparatus comprising a light emitting unit including the light emitting device package claimed in claim 1 .
7. A light emitting device package comprising:
a package body including a frame and a body;
a light emitting device including first and second bonding parts and disposed on the body;
a reflective resin layer disposed between the light emitting device and a side surface of a cavity formed in the body;
a transparent resin layer on the light emitting device; and
a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
8. The light emitting device package of claim 7 , wherein the transparent resin layer comprises a first transparent layer disposed between the light emitting device and the phosphor layer.
9. The light emitting device package of claim 8 , wherein the transparent resin layer comprises a second transparent layer disposed between the reflective resin layer and the light emitting device.
10. A lighting apparatus comprising a light emitting unit including the light emitting device package claimed in claim 9 .
11. The light emitting device package of claim 8 , wherein the reflective resin layer comprises:
a first reflective resin layer disposed on the light emitting device and a side surface of the cavity; and
a second reflective resin layer disposed between first and second bonding parts of the light emitting device and the body.
12. A lighting apparatus comprising a light emitting unit including the light emitting device package claimed in claim 11 .
13. A lighting apparatus comprising a light emitting unit including the light emitting device package claimed in claim 8 .
14. A lighting apparatus comprising a light emitting unit including the light emitting device package claimed in claim 7 .