Display apparatus and method of manufacturing the same
A display apparatus may include a display panel and a plurality of flexible printed circuit boards connected to the display panel. The display panel may include first regions arranged in a first direction and may include a plurality of first alignment marks, which are respectively provided on the first regions and are arranged in the first direction. Each of the flexible printed circuit boards may include a plurality of second alignment marks arranged in the first direction and overlapped with the first alignment marks, an insulating layer spaced apart from the second alignment marks in a second direction crossing the first direction, and a plurality of supplementary alignment marks spaced apart from the second alignment marks by a first distance in the second direction, the supplementary alignment marks being openings defined in the insulating layer.
1. A display apparatus, comprising:
a display panel including first regions arranged in a first direction and a plurality of first alignment marks which are respectively provided on the first regions and are arranged in the first direction; and
a plurality of flexible printed circuit boards connected to the display panel, each of the flexible printed circuit boards including:
a plurality of second alignment marks arranged in the first direction and overlapped with the first alignment marks;
an insulating layer spaced apart from the second alignment marks in a second direction crossing the first direction; and
a plurality of supplementary alignment marks spaced apart from the second alignment marks by a first distance in the second direction, the supplementary alignment marks being openings defined in the insulating layer.
2. The display apparatus as claimed in claim 1 , wherein:
the display panel further includes first and second substrates facing each other and a liquid crystal layer between the first and second substrates,
the first regions are defined in the first substrate,
the first alignment marks are provided on the first regions of the first substrate, and
the first regions are disposed to be adjacent to a side of the first substrate in the second direction.
3. The display apparatus as claimed in claim 2 , wherein:
the first substrate further includes:
a plurality of pixels connected to a plurality of gate lines and a plurality of data lines; and
a plurality of first pads arranged in the first direction and provided on the first regions, respectively, and
wherein:
the data lines are connected to the first pads, and
the first alignment marks are spaced apart from each other with the first pads interposed therebetween.
4. The display apparatus as claimed in claim 3 , wherein:
each of the flexible printed circuit boards further includes a second region, which is adjacent to a side thereof in the second direction, and a plurality of second pads, which are provided on the second region,
the second region of each of the flexible printed circuit boards is overlapped with a corresponding a first region of the first regions,
the insulating layer of each of the flexible printed circuit boards is provided on a third region of each of the flexible printed circuit boards, which is adjacent to the second region of each of the flexible printed circuit boards, and
the first alignment marks of each of the flexible printed circuit boards are spaced apart from each other in the first direction with the second pads of each of the flexible printed circuit boards interposed therebetween.
5. The display apparatus as claimed in claim 4 , further comprising a plurality of anisotropic conductive films provided between the first regions of the first substrate and the second regions of the flexible printed circuit boards.
6. The display apparatus as claimed in claim 5 , wherein the first pads on the first regions and the second pads on the second regions are electrically connected to each other through the anisotropic conductive films.
7. The display apparatus as claimed in claim 5 , wherein the insulating layer of each of the flexible printed circuit boards is thicker than each of the anisotropic conductive films.
8. The display apparatus as claimed in claim 1 , wherein the first and second alignment marks and the supplementary alignment marks have the same shape.
9. The display apparatus as claimed in claim 8 , wherein each of the first and second alignment marks and the supplementary alignment marks includes a first extended portion extending in the first direction and a plurality of second extended portions extending from both end portions of the first extended portion in the second direction.
10. The display apparatus as claimed in claim 8 , wherein each of the first and second alignment marks and the supplementary alignment marks has a rectangular, circular, or a letter ‘T’-like shape.
11. The display apparatus as claimed in claim 1 , wherein the insulating layer of each of the flexible printed circuit boards includes an organic insulating layer.
12. A method of manufacturing a display apparatus, the method comprising:
preparing a first substrate, in which first regions arranged in a first direction are defined, the first substrate including a plurality of first alignment marks provided on the first regions, respectively;
preparing a plurality of flexible printed circuit boards, each of which includes a plurality of second alignment marks arranged in the first direction, an insulating layer spaced apart from the second alignment marks in a second direction crossing the first direction, and a plurality of supplementary alignment marks spaced apart from the second alignment marks by a first distance in the second direction, the supplementary alignment marks being formed by etching the insulating layer;
overlapping the supplementary alignment marks to the first alignment marks;
moving the flexible printed circuit boards by the first distance in the second direction to overlap the second alignment marks to the first alignment marks;
attaching the flexible printed circuit boards to the first regions of the first substrate; and
disposing a second substrate to face the first substrate and disposing a liquid crystal layer between the first and second substrates.
13. The method as claimed in claim 12 , wherein:
the first substrate further includes:
a plurality of pixels connected to a plurality of gate lines and a plurality of data lines; and
a plurality of first pads arranged in the first direction and provided on the first regions, respectively, and
wherein:
the first regions are adjacent to a side of the first substrate in the second direction,
the data lines are connected to the first pads on the first regions, and
the first alignment marks on each of the first regions are spaced apart from each other with the first pads, which are provided on each of the first regions and are interposed between the first alignment marks.
14. The method as claimed in claim 13 , wherein:
each of the flexible printed circuit boards further includes a second region, which is adjacent to a side thereof in the second direction, and a plurality of second pads, which are provided on the second region,
the second region of each of the flexible printed circuit boards is overlapped with a corresponding one of the first regions,
the insulating layer of each of the flexible printed circuit boards is provided on a third region of each of the flexible printed circuit boards, which is adjacent to the second region of each of the flexible printed circuit boards, and
the first alignment marks of each of the flexible printed circuit boards are spaced apart from each other in the first direction with the second pads of each of the flexible printed circuit boards interposed therebetween.
15. The method as claimed in claim 14 , wherein:
the preparing of the flexible printed circuit boards further includes disposing a plurality of anisotropic conductive films on the second regions of the flexible printed circuit boards, and
the flexible printed circuit boards are attached to the first regions of the first substrate by the anisotropic conductive films.
16. The method as claimed in claim 15 , wherein the first pads on the first regions and the second pads on the second regions are electrically connected to each other through the anisotropic conductive films.
17. The method as claimed in claim 15 , wherein the insulating layer of each of the flexible printed circuit boards is thicker than each of the anisotropic conductive films.
18. The method as claimed in claim 12 , wherein the first and second alignment marks and the supplementary alignment marks have the same shape.
19. The method as claimed in claim 17 , wherein each of the first and second alignment marks and the supplementary alignment marks includes a first extended portion extending in the first direction and a plurality of second extended portions extending from both end portions of the first extended portion in the second direction.
20. The method as claimed in claim 12 , wherein the insulating layer includes an organic insulating layer.