Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, and laminate manufacturing method
Provided are a polyamic acid solution that can be formed into a film without peeling even when the film is thick and can be stably stored at room temperature, and a laminate that can be suitably used for production of a flexible device. In the alkoxysilane-modified polyamic acid solution according to the present invention, an additive amount of an alkoxysilane compound that contains an amino group is more than 0.050 parts by weight and less than 0.100 parts by weight.
1. An alkoxysilane-modified polyamic acid solution obtained by reacting an alkoxysilane compound and a polyamic acid in a solution with stirring at 50° C. to 80° C. for 2 to 5 hours, wherein the alkoxysilane compound comprises an amino group,
wherein
the polyamic acid is obtained by reacting an aromatic diamine and an aromatic tetracarboxylic acid dianhydride in a solvent,
a molar ratio obtained by dividing a total number of moles of the aromatic tetracarboxylic acid dianhydride by a total number of moles of the aromatic diamine is 0.980 or more and 0.9995 or less, and,
when an amount of the polyamic acid contained in the alkoxysilane-modified polyamic acid solution is 100 parts by weight, an additive amount of the alkoxysilane compound is more than 0.050 parts by weight and less than 0.100 parts by weight.
2. The alkoxysilane-modified polyamic acid solution according to claim 1 , wherein
the aromatic tetracarboxylic acid dianhydride is 3,3′,4,4′-biphenyl-tetracarboxylic acid dianhydride, and
the aromatic diamine is an aromatic diamine represented by the following Formula (1):
wherein n is an integer of 1 to 3.
3. The alkoxysilane-modified polyamic acid solution according to claim 1 , wherein a main component of the solvent is an amide solvent.
4. A flexible device comprising:
a polyimide film obtained from the alkoxysilane-modified polyamic acid solution according to claim 1 ; and
an electronic element formed on the polyimide film.
5. A laminate manufacturing method comprising:
obtaining a laminate by laminating a polyimide film on an inorganic substrate,
wherein the polyimide film is obtained from the alkoxysilane-modified polyamic acid solution according to claim 1 by casting and thermally imidizing the alkoxysilane-modified polyamic acid solution on the inorganic substrate.
6. A flexible device manufacturing method comprising:
forming an electronic element on a polyimide film of a laminate obtained using the laminate manufacturing method according to claim 5 ; and
peeling the polyimide film, on which the electronic element is formed, from an inorganic substrate of the laminate.
7. A laminate comprising:
a polyimide film that is obtained from the alkoxysilane-modified polyamic acid solution according to claim 1 ; and
an inorganic substrate on which the polyimide film is laminated,
wherein the polyimide film has a linear expansion coefficient of from 1 to 10 ppm/° C.
8. The laminate according to claim 7 ,
wherein
the inorganic substrate has a thickness of from 0.4 to 5.0 mm, and
the polyimide film has a thickness of from 10 to 50 μm.
9. An alkoxysilane-modified polyamic acid solution obtained by reacting an alkoxysilane compound and a polyamic acid in a solution with stirring at 50° C. to 80° C. for 2 to 5 hours, wherein the alkoxysilane compound comprises an amino group,
wherein the polyamic acid is obtained by reacting an aromatic diamine and an aromatic tetracarboxylic acid dianhydride in a solvent,
wherein a molar ratio obtained by dividing a total number of moles of the aromatic tetracarboxylic acid dianhydride by a total number of moles of the aromatic diamine is 0.980 or more and 0.9995 or less,
wherein, when an amount of the polyamic acid contained in the alkoxysilane-modified polyamic acid solution is 100 parts by weight, an additive amount of the alkoxysilane compound is more than 0.050 parts by weight and less than 0.100 parts by weight, and
wherein a water content of the alkoxysilane-modified polyamic acid solution is 500 ppm or more and 3000 ppm or less.
10. A method of manufacturing an alkoxysilane-modified polyamic acid solution, the method comprising:
obtaining a polyamic acid by reacting an aromatic diamine and an aromatic tetracarboxylic acid dianhydride in a solvent; and
obtaining an alkoxysilane-modified polyamic acid solution by reacting an alkoxysilane compound and the polyamic acid in a solution with stirring at 50° C. to 80° C. for 2 to 5 hours, wherein the alkoxysilane compound comprises an amino group,
wherein
a molar ratio obtained by dividing a total number of moles of the aromatic tetracarboxylic acid dianhydride by a total number of moles of the aromatic diamine is 0.980 or more and 0.9995 or less, and,
when an amount of the polyamic acid contained in the alkoxysilane-modified polyamic acid solution is 100 parts by weight, an additive amount of the alkoxysilane compound is more than 0.050 parts by weight and less than 0.100 parts by weight.
11. A method of manufacturing an alkoxysilane-modified polyamic acid solution, the method comprising:
obtaining a polyamic acid by reacting an aromatic diamine and an aromatic tetracarboxylic acid dianhydride in a solvent; and
obtaining an alkoxysilane-modified polyamic acid solution by reacting an alkoxysilane compound and the polyamic acid in a solution with stirring at 50° C. to 80° C. for 2 to 5 hours, wherein the alkoxysilane compound comprises an amino group,
wherein a molar ratio obtained by dividing a total number of moles of the aromatic tetracarboxylic acid dianhydride by a total number of moles of the aromatic diamine is 0.980 or more and 0.9995 or less,
wherein, when an amount of the polyamic acid contained in the alkoxysilane-modified polyamic acid solution is 100 parts by weight, an additive amount of the alkoxysilane compound is more than 0.050 parts by weight and less than 0.100 parts by weight, and
wherein a water content of the alkoxysilane-modified polyamic acid solution is 500 ppm or more and 3000 ppm or less.