Co-formed element with low conductivity layer
A co-formed element includes a core structure which has a root portion and is formed from a high thermal conductivity ceramic matrix composite material, and a low thermal conductivity layer co-formed with the core structure and surrounding the root portion of the core structure.
1. A process for forming a co-formed element comprising the steps of:
placing a core structure formed from a fully densified, high thermal conductivity ceramic matrix material having a residual porosity less than 10% into a mold;
placing a three dimensional woven material into said mold so that said three dimensional woven material surrounds a root portion of said core structure;
injecting a matrix material into said mold so that said three dimensional woven material is infiltrated with said matrix material; and
allowing said matrix material to solidify to form said co-formed element.
2. The process of claim 1 , wherein said residual porosity is less than 5.0%.
3. The process of claim 1 , wherein said injecting step comprises injecting a matrix material selected from the group consisting of a silicon nitride material, at least one glassy material, a silicon-nitrogen-carbon material, and combinations thereof in a silicon carbide matrix.
4. The process of claim 1 , further comprising forming said core structure from silicon carbide fiber in a silicon carbide matrix material.
5. The process of claim 1 , further comprising forming said three dimensional woven material from silicon carbide fibers.