IP Library › Granted Patent US 10,312,215
Granted Patent B2
US 10,312,215 · App. 15/445,549 · Granted Jun 4, 2019

Electrode assembly and method for manufacturing same

Inventors: Yong Hee Kim (Daejeon, KR); Sang Don Jung (Daejeon, KR)
Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTIT
H01L24/81A61B5/0031A61B5/686A61N1/0472A61N1/05H01L21/2636H01L21/76879H01L21/76898H01L23/481H01L24/13A61B2562/0209A61B2562/125
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Quick Facts
Patent No.
US 10,312,215
App. No.
15/445,549
Granted
Jun 4, 2019
Kind
B2
Abstract

Provided is an electrode assembly which may be manufactured by providing a first substrate and a second substrate, plasma treating the first substrate, forming an electrode on the first substrate, and thermally compressing the first substrate and the second substrate, with the electrode therebetween, wherein each of the first substrate and the second substrate includes a fluorine-based polymer.

Claims (25)

1. A method for manufacturing an electrode assembly, the method comprising:

providing a first substrate and a second substrate;

plasma treating the first substrate;

forming an electrode on the first substrate;

thermally compressing the first substrate and the second substrate, with the electrode therebetween; and

patterning a portion of the second substrate to thereby form a through-hole that exposes a portion of a top face of the electrode,

wherein each of the first substrate and the second substrate includes a fluorine-based polymer.

2. The method of claim 1 , wherein the patterning of a portion of the second substrate comprises:

forming a protective layer on the top face of the second substrate;

patterning the protective layer to removing a first region;

etching the second substrate corresponding to a patterned and removed portion of the protective layer; and

removing the protective layer.

3. The method of claim 2 , further comprising forming a contact part in the through-hole, wherein the contact part is composed of a porous conductive material.

4. The method of claim 3 , wherein the contact part is formed by using an electro-deposition method.

5. An electrode assembly comprising:

a first substrate;

an electrode provided on the first substrate;

a second substrate which is thermally compressed to the first substrate, with the electrode therebetween, wherein each of the first substrate and the second substrate includes a fluorine-based polymer; and

a contact part provided on the electrode, wherein the contact part is porous.

6. The electrode assembly of claim 5 , wherein the fluorine-based polymer comprises at least one among polychlorotrifluoroethylene (PCTFE), perfluoro-2,2-dimethyl-1,3-dioxide (PDD), chlorotrifluoroethylene (CTFE), perfluoro-3-butenyl-vinylether (PBVE), perfluoropropylvinylether (PPVE), polytetrafluoroethylene (PTFE), polyvinylidenefluoride (PVDF), polyvinylfluoride (PVF), vinylidene fluoride (VDF), a PBVE-based homopolymer (Cytop™), and a copolymer including at least two thereof.

7. The electrode assembly of claim 6 , wherein the copolymer is a copolymer of ethylene and CTFE (ECTFE), a copolymer of ethylene and TFE (ETFE), a copolymer of fluorinated ethylene and propylene (FEP), hexafluoropropylene (HFP), a copolymer of TFE and PPVE (PFA), a copolymer of TFE and PDD (Teflon™ AF), tetrafluoroethylene (TFE), or poly(TFE-co-HFP-co-VDF) (THV).

8. The electrode assembly of claim 5 , wherein

the second substrate comprises a through-hole that exposes a portion of a top face of the electrode; and

the contact part is provided in the through-hole.

9. The electrode assembly of claim 5 , wherein the chemical bonding comprises a covalent bonding formed by the first radical and the second radical.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2017
From: KIM, YONG HEE; JUNG, SANG DON
To: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Reel/Frame 041425/0482 →
Priority Claims (1)
KR 10-2016-0024374 · Feb 29, 2016 · national
Continuity (1)
Related Publication 20170250157A1 · Aug 31, 2017
Cited By (1)
US 12,533,512