Electrical interconnection system and electrical connectors for the same
The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.
1. A connector comprising:
first and second wafers, each wafer comprising:
a housing comprising a mating edge configured to face a mating connector and orthogonal to a mounting edge configured to mount onto a board;
a plurality of pairs of signal contacts and a plurality of shielding contacts fixed within the housing and alternately arranged with one another along a transverse direction of the housing, each signal contact and each shielding contact in the pluralities of pairs of signal contacts and shielding contacts comprising:
a contact portion outside and at the mating edge of the housing for contacting a corresponding contact of a mating connector;
a mounting portion outside and at the mounting edge of the housing for contacting a corresponding conductive trace on a board; and
a connecting portion disposed within the housing and connecting the contact portion and the mounting portion, the connecting portion having opposing longitudinal edges extending from the mating edge to the mounting edge, the contact portions of each pair of signal contacts in one wafer facing the contact portion of a different corresponding shielding contact in the other wafer and when viewed from a side of the connector, the longitudinal edges of the contact portions of the pair of signal contacts are disposed between the longitudinal edges of the contact portion of the different corresponding shielding contact.