High power density inverter (II)

1. A single phase, non-insulated, miniaturized DC/AC power inverter ( 1 ) having an output power density higher than 3000 W/dm 3 and comprising:

a DC input;

an AC output;

at least a H full-bridge topology switching circuit ( 201 , 202 ) having an input connected to the DC input and an output connected to the AC output, and comprising switches made of wide-band semiconductors and preferably of gallium nitride or GaN semiconductors;

at least one common mode noise Electromagnetic Interference (EMI) filter ( 100 ) connected between the DC input and the input of the H full-bridge switching circuit, between the output of the H full-bridge switching circuit and the AC output respectively, said common mode noise filters ( 100 ) being referenced to an earth shielding or directly to earth ( 204 ), said common noise filters ( 100 ) comprising filtering inductors and so-called Y capacitors;

at least one differential mode noise Electromagnetic Interference (EMI) filter ( 101 ) connected, in series with a corresponding common mode noise filter ( 100 ), between the DC input and the input of the H full-bridge switching circuit, between the output of the H full-bridge switching circuit and the AC output respectively, said differential mode noise filters ( 101 ) comprising so-called X filtering capacitors and optionally inductors;

a ripple-compensating active filter comprising a switching half-bridge topology ( 203 ) provided in parallel with the H full-bridge switching circuit and connected to a LC filter, made of at least one inductor (L 6 ) and at least one storage capacitor (C 5 );

wherein said power inverter ( 1 ) is packaged in a casing made of an external electrically conductive enclosure ( 501 ) containing a fan blowing in an axial direction to a side face of the casing and, in a stacked elevation arrangement, successively from a bottom side to a top side, a layer of active filter capacitors ( 514 ), a heatsink ( 512 ), a layer of wideband semiconductors switches ( 509 ) connected to a Printed Circuit Board (PCB) with thermal vias ( 510 ) and a layer of active filtering inductors ( 504 ), the fan and the component stacked arrangement being designed so as, in operation, an external temperature of the casing does not overcome 60° C. in any point, for an ambient temperature of maximum 30° C. under a maximum load of 2 kVA.

2. The DC/AC power inverter of claim 1 , wherein the layer of active filter capacitors ( 514 ) is composed of Printed Circuit Board (PCB) mounted ( 513 ) rows of regularly spaced multilayer ceramic capacitors (MLCC), said capacitors being separated by a gap, said gap being preferably of about 1 mm and oriented in the blowing direction of the fan.

3. The DC/AC power inverter of claim 1 , wherein the heatsink ( 512 ) is a one-piece machined metallic heatsink selected from the group consisting of a multiple blades, honeycomb, interlaced-fins and metal foam heatsink, said heatsink ( 512 ) being adjacent to the layer of active filter capacitors ( 514 ).

4. The DC/AC power inverter of claim 1 , wherein the casing external conductive enclosure ( 501 ) surrounds a conductive shielding ( 503 ) separated thereof by a thermally conductive interface made of a gap pad ( 502 ).

5. The DC/AC power inverter of claim 1 , wherein the active filtering inductors ( 504 ) are composed of ferrite cores on which Litz wire is directly wound without a coil former, each inductor ( 504 ) being made of two coils separated by a ceramic foil ( 505 ) placed between the ferrites cores in order to create an air gap as well as thermal drain.

6. The DC/AC power inverter of claim 1 , wherein the layer of wideband semiconductors switches ( 509 ) connected to a PCB with thermal vias ( 510 ) is adjacent the heatsink thanks to a ceramic insulation ( 511 ) and microspring contacts ( 507 ), silicone foam ( 508 ) being provided in gaps in order to uniformly spread switch contact pressure on the heatsink ( 512 ).

7. The DC/AC power inverter of claim 4 , wherein the casing enclosure ( 501 ), the conductive shielding ( 503 ) and the heatsink ( 512 ) are made of copper.

8. The DC/AC power inverter of claim 1 , wherein the common mode and differential mode Electromagnetic Interference (EMI) filters, are separated from the rest in the casing.

9. The DC/AC power inverter of claim 1 , wherein part of the active filtering inductors ( 504 ) are thermally fastened to a conductive shield ( 503 ).