Electric connection structure and electric connection member
There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.
1. An electric connection member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer,
the conductive interconnect is disposed in the recess,
a metal nano-ink is disposed on the conductive interconnect, and
all of the metal nano-ink is contained inside the recess, and
wherein the metal nano-ink is an encapsulated metal nano-ink that has a plurality of metal nanoparticles covered by a protective agent in a capsule and that forms a conductive thin film upon breaking of the capsule by means of external stimulus.
2. The electric connection member according to claim 1 , wherein the conductive thin film is formed by breaking the capsule and performing heat treatment at a temperature of less than 200° C.
3. The electric connection member according to claim 2 , wherein the protective agent is an amphiphilic molecule, the plurality of metal nanoparticles are dispersed in a hydrophobic organic solvent, and the capsule is composed of a hydrophilic compound derivative.
4. The electric connection member according to claim 2 , wherein the substrate is a flexible substrate.
5. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on the electric connection member according to claim 2 ,
wherein the conductive interconnect and the electrode are joined to each other by sintering the metal nano-ink in the recess of the insulating adhesive layer, and a surface of the insulating adhesive layer adheres to a surface of the electronic component.
6. An intermediate member used for producing the electric connection member according to claim 2 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the intermediate member is provided with a recess that opens at a side of the insulating adhesive layer, and
the conductive interconnect is disposed in the recess.
7. The electric connection member according to claim 1 , wherein the protective agent is an amphiphilic molecule, the plurality of metal nanoparticles are dispersed in a hydrophobic organic solvent, and the capsule is composed of a hydrophilic compound derivative.
8. The electric connection member according to claim 7 , wherein the hydrophobic organic solvent has an n-octanol/water partition coefficient of not less than 2.
9. The electric connection member according to claim 7 , wherein the hydrophilic compound derivative has a contact angle of not more than 90° with respect to water.
10. The electric connection member according to claim 7 , wherein the amphiphilic molecule has a hydrophile-lipophile balance value of 0to 13.
11. The electric connection member according to claim 7 , wherein the substrate is a flexible substrate.
12. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on the electric connection member according to claim 7 ,
wherein the conductive interconnect and the electrode are joined to each other by sintering the metal nano-ink in the recess of the insulating adhesive layer, and a surface of the insulating adhesive layer adheres to a surface of the electronic component.
13. An intermediate member used for producing the electric connection member according to claim 7 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the intermediate member is provided with a recess that opens at a side of the insulating adhesive layer, and
the conductive interconnect is disposed in the recess.
14. The electric connection member according to claim 2 , wherein the substrate is a flexible substrate.
15. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on the electric connection member according to claim 1 ,
wherein the conductive interconnect and the electrode are joined to each other by sintering the metal nano-ink in the recess of the insulating adhesive layer, and a surface of the insulating adhesive layer adheres to a surface of the electronic component.
16. An intermediate member used for producing the electric connection member according to claim 1 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the intermediate member is provided with a recess that opens at a side of the insulating adhesive layer, and
the conductive interconnect is disposed in the recess.