Electro-optic display backplane structure with drive components and pixel electrodes on opposed surfaces
The subject matter presented herein relates to a method for producing a backplane for electro-optic displays. The method may include providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, patterning the first conductive material by cutting through the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit and creating a plurality of vias on the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides. The method may further include creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.
1. A method for producing a backplane for electro-optic displays comprising:
providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, wherein the substrate is at least 24 inches by 48 inches in size;
patterning the first conductive material by scribing the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit;
creating a plurality of vias through the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides; and
creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.
2. The method of claim 1 , wherein the pattering the first conductive material step comprising cutting through the first conductive material using mechanical forces.
3. The method of claim 1 , wherein the patterning the first conductive material step comprising cutting through the first conductive material using a beam of energy or particles.
4. The method of claim 3 , wherein cutting through the first conductive material comprising using a laser.
5. The method of claim 4 , wherein the creating a plurality of conductive traces step comprising placing conductive material from the vias to the driver circuit.
6. A method for producing a backplane for electro-optic displays comprising:
providing a substrate coated with a first conductive material on a first side, wherein the substrate is at least 24 inches by 48 inches in size;
patterning the first conductive material by scribing the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit;
creating a plurality of vias through the substrate, the plurality of vias extending through the substrate; and
creating a plurality of conductive traces on a second side of the substrate connecting the vias to the driver circuit, the second side being position opposite to the first side of the substrate.
7. The method of claim 6 , wherein placing conductive material comprising using a plotter to place conductive material between the vias and the driver circuit.