Smart card simultaneously having two read/write modes and method for producing same
A smart card with two read-write modes includes antenna layer, and an antenna and a chip module circuits on the antenna layer, wherein the antenna and the chip module circuit are electrically connected via an elastic conductive device. The invention also provides a manufacturing method of the aforesaid smart card with two read-write modes, which includes steps of: embedding an antenna on a back side or a front side of an antenna layer; after completing embedding on the antenna layer, add bedding sheets, printed sheets and protection films respectively above and underneath the antenna layer, then laminating to obtain a card base carrier; cutting card from the treated whole-sheet card base carrier to obtain a card base, and milling slots on the obtained card base, then finally encapsulating.
1. A smart card simultaneously having two read-write modes, comprising an antenna layer ( 2 ) and an antenna ( 3 ) and a chip module circuit layer ( 4 ) arranged on the antenna layer ( 2 ), wherein the antenna ( 3 ) and the chip module circuit layer ( 4 ) are electrically connected through a metallic or non-metallic elastic conductive device ( 5 ), a coil wire end ( 31 ) of the antenna ( 3 ) is electrically connected with the elastic conductive device ( 5 ), the elastic conductive device ( 5 ) is arranged in a region corresponding to a circuit contact point of the chip module circuit layer ( 4 ), one surface of the elastic conductive device ( 5 ) is in electric contact connection with the circuit contact point of the chip module circuit layer ( 4 ), and the coil wire end ( 31 ) of the antenna ( 3 ) is made into a contact pad in a single-loop or multi-loop meandering winding manner and is arranged in a region corresponding to the circuit contact point of the chip module circuit layer ( 4 ) on the antenna layer ( 2 ).
2. The smart card, as recited in claim 1 , wherein the coil wire end ( 31 ) of the antenna ( 3 ) is electrically connected with the other surface of the elastic conductive device ( 5 ) in a welding manner.
3. The smart card, as recited in claim 1 , wherein the coil wire end ( 31 ) of the antenna ( 3 ) is electrically connected with the other surface of the elastic conductive device ( 5 ) in a direct contact manner.
4. The smart card, as recited in claim 2 , wherein the thickness of the antenna layer ( 2 ) is 0.13-0.16 mm.
5. The smart card, as recited in claim 3 , wherein the thickness of the antenna layer ( 2 ) is 0.13-0.16 mm.
6. A production method of a smart card simultaneously having two read-write modes, comprising steps of:
1) embedding antenna ( 3 ): embedding an antenna ( 3 ) on a back surface or a surface of an antenna layer ( 2 ), and placing a coil wire end ( 31 ) of the antenna ( 3 ) in a region corresponding to circuit contact points of a chip module circuit layer ( 4 ), wherein the coil wire end ( 31 ) of the antenna ( 3 ) is made into a contact pad in a meandering winding manner, and the contact pad is located in a region corresponding to the circuit contact point of the chip module circuit layer ( 4 );
2) laminating: after embedding the antenna ( 3 ) on the antenna layer ( 2 ), respectively adding a pad layer, a printing layer and a protection layer on an upper and a lower parts of the antenna layer ( 2 ), and laminating to obtain a card base carrier;
3) cutting card and milling grooves: cutting a card from the laminated integral card base carrier to finally obtain a card base, milling grooves on the obtained card base, at first milling grooves on a position where a chip module is placed, firstly milling a first recess (B 5 ), wherein a thickness of the first recess (B 5 ) is equal to that of the chip module boundary, then, milling a second recess (B 6 ) in a middle of the first recess (B 5 ), wherein a milling cutter provided with a special sensor is used for milling the position, and the milling cutter detects whether an antenna ( 3 ) embedding layer is milled in the groove milling process in real time, immediately stops at a maximum milled depth value according to a preset program once milling the coil wire end ( 31 ) of the embedded antenna ( 3 ) and memorizes the maximum milled depth value, and finally, milling a third recess (B 3 ) on a position where an elastic device is placed, wherein a depth of the third recess (B 3 ) is determined by the memorized value; and
4) encapsulating: firstly placing the elastic device in the third recess (B 3 ) and electrically connecting the elastic device with the coil wire end ( 31 ) of the antenna ( 3 ), putting the chip module circuit layer ( 4 ) in the first recess (B 5 ) and the second recess (B 6 ) on positions where the circuit contact points are corresponding to the elastic device, and finally, securing the chip module layer into the first and/or the second recesses.